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FMP76-010T

Description
62 A, 100 V, 0.011 ohm, 2 CHANNEL, N AND P-CHANNEL, Si, POWER, MOSFET
Categorysemiconductor    Discrete semiconductor   
File Size102KB,4 Pages
ManufacturerIXYS ( Littelfuse )
Websitehttp://www.ixys.com/
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FMP76-010T Overview

62 A, 100 V, 0.011 ohm, 2 CHANNEL, N AND P-CHANNEL, Si, POWER, MOSFET

FMP76-010T Parametric

Parameter NameAttribute value
Minimum breakdown voltage100 V
Number of terminals5
Processing package descriptionPLASTIC, ISOPLUS, I4-PAK-5
each_compliYes
EU RoHS regulationsYes
stateActive
Rated avalanche energy500 mJ
Shell connectionISOLATED
structureCOMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
Maximum leakage current62 A
Maximum drain on-resistance0.0110 ohm
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
jesd_30_codeR-PSIP-T5
jesd_609_codee1
moisture_sensitivity_levelNOT SPECIFIED
Number of components2
operating modeENHANCEMENT MODE
Maximum operating temperature150 Cel
Packaging MaterialsPLASTIC/EPOXY
packaging shapeRECTANGULAR
Package SizeIN-LINE
eak_reflow_temperature__cel_NOT SPECIFIED
larity_channel_typeN-CHANNEL AND P-CHANNEL
Maximum leakage current pulse300 A
qualification_statusCOMMERCIAL
surface mountNO
terminal coatingTIN SILVER COPPER
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
ime_peak_reflow_temperature_max__s_NOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
dditional_featureAVALANCHE RATED, UL RECOGNIZED
Advance Technical Information
Trench
TM
P & N-Channel
Power MOSFET
Common Drain Topology
FMP76-01T
V
DSS
3
4
5
4
3
P CH.
- 100V
- 54A
24mΩ
Ω
70ns
N CH.
100V
62A
11mΩ
Ω
67ns
T1
T2
I
D25
R
DS(on)
t
rr(typ)
1
1
2
2
ISOPLUS i4-Pak
TM
Symbol
T
J
T
JM
T
stg
V
ISOLD
T
L
T
SOLD
F
C
50/60H
Z
, RMS, t = 1min, leads-to-tab
1.6mm (0.062 in.) from case for 10s
Plastic body for 10s
Mounting force
Test Conditions
Maximum Ratings
-55 ... +150
150
-55 ... +150
2500
300
260
20..120 / 4.5..27
°C
°C
°C
~V
°C
°C
N/lb.
Features
Symbol
C
P
d
S
,d
A
d
S
,d
A
Weight
Test Conditions
Coupling capacitance between shorted
pins and mounting tab in the case
pin - pin
pin - backside metal
1.7
5.5
9
Characteristic Values
Min.
Typ.
Max.
40
pF
mm
mm
g
Silicon chip on Direct-Copper Bond
(DCB) substrate
- UL recognized package
- Isolated mounting surface
- 2500V electrical isolation
Avalanche rated
Low Q
G
Low Drain-to-Tab capacitance
Low package inductance
1
Isolated Tab
5
P - CHANNEL
Symbol
V
DSS
V
DGR
V
GSS
V
GSM
I
D25
I
DM
I
A
E
AS
P
D
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C, R
GS
= 1MΩ
Continuous
Transient
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
T
C
= 25°C
Maximum Ratings
- 100
- 100
±
20
±
30
- 54
- 230
- 38
1.0
132
V
V
V
V
A
A
A
J
W
Advantages
Low gate drive requirement
High power density
Low drain to ground capacitance
Fast switching
Applications
DC and AC motor drives
Class AB audio amplifiers
Multi-phase DC to DC converters
Industrial battery chargers
Switching power supplies
© 2008 IXYS CORPORATION, All rights reserved
DS100037(09/08)

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