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CD74HC7266M

Description
XNOR GATE
Categorylogic    logic   
File Size184KB,4 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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CD74HC7266M Overview

XNOR GATE

CD74HC7266M Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionSOP, SOP14,.25
Reach Compliance Codenot_compliant
JESD-30 codeR-PDSO-G14
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeXNOR GATE
MaximumI(ol)0.004 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply2/6 V
Prop。Delay @ Nom-Sup35 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

CD74HC7266M Related Products

CD74HC7266M CD54HC7266H CD74HC7266E
Description XNOR GATE CD54HC7266H XNOR GATE
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction SOP, SOP14,.25 , DIE OR CHIP DIP, DIP14,.3
Reach Compliance Code not_compliant unknown not_compliant
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type XNOR GATE XNOR GATE XNOR GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Encapsulate equivalent code SOP14,.25 DIE OR CHIP DIP14,.3
power supply 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Sup 35 ns 35 ns 35 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Is it Rohs certified? incompatible - incompatible
JESD-30 code R-PDSO-G14 - R-PDIP-T14
JESD-609 code e0 - e0
Number of terminals 14 - 14
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOP - DIP
Package shape RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE - IN-LINE
surface mount YES - NO
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form GULL WING - THROUGH-HOLE
Terminal pitch 1.27 mm - 2.54 mm
Terminal location DUAL - DUAL
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