CD54HC7266H datasheet, PDF - EEWORLD Datasheet

CD54HC7266H: DescriptionCD54HC7266H; Categorylogic logic; File Size184KB，4 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD54HC7266H Overview

CD54HC7266H

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
package instruction	, DIE OR CHIP
Reach Compliance Code	unknown
Load capacitance (CL)	50 pF
Logic integrated circuit type	XNOR GATE
MaximumI(ol)	0.004 A
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Encapsulate equivalent code	DIE OR CHIP
power supply	2/6 V
Prop。Delay @ Nom-Sup	35 ns
Certification status	Not Qualified
Schmitt trigger	NO
technology	CMOS
Temperature level	MILITARY

	CD54HC7266H	CD74HC7266M	CD74HC7266E
Description	CD54HC7266H	XNOR GATE	XNOR GATE
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	, DIE OR CHIP	SOP, SOP14,.25	DIP, DIP14,.3
Reach Compliance Code	unknown	not_compliant	not_compliant
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	XNOR GATE	XNOR GATE	XNOR GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Encapsulate equivalent code	DIE OR CHIP	SOP14,.25	DIP14,.3
power supply	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	35 ns	35 ns	35 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Is it Rohs certified?	-	incompatible	incompatible
JESD-30 code	-	R-PDSO-G14	R-PDIP-T14
JESD-609 code	-	e0	e0
Number of terminals	-	14	14
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	SOP	DIP
Package shape	-	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	IN-LINE
surface mount	-	YES	NO
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	GULL WING	THROUGH-HOLE
Terminal pitch	-	1.27 mm	2.54 mm
Terminal location	-	DUAL	DUAL

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