R5F56106WNBG datasheet, PDF - EEWORLD Datasheet

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R5F56106WNBG: DescriptionThe RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，86 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R5F56106WNBG Overview

The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.

R5F56106WNBG Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
Parts packaging code	BGA
package instruction	FBGA, BGA176,15X15,32
Contacts	176
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Is Samacsys	N
Has ADC	YES
Address bus width
bit size	64
CPU series	RX
maximum clock frequency	100 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B176
Number of terminals	176
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA176,15X15,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	131072
rom(word)	1048576
ROM programmability	FLASH
speed	100 MHz
Maximum slew rate	100 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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Datasheet

RX610 Group Datasheet

RENESAS 32-Bit MCU

R01DS0097EJ0100

Rev.1.00

Apr 22, 2011

1.1

Overview

Features

The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.

One basic instruction is executable in one cycle of the system clock. Calculation functionality is further enhanced, with

the inclusion of a single-precision floating-point calculation unit as well as a 32-bit multiplier and divider. Additionally,

code efficiency is improved by instructions with lengths that are variable in byte units and by an enhanced range of

addressing modes.

Timers, serial communication interfaces, I

C bus interfaces, an A/D converter, and a D/A converter are incorporated as

peripheral functions which are essential to embedded devices.

Facilities for connecting external memory are also included, enabling direct connection to memory and peripheral LSI

circuits. The on-chip memory is flash memory capable of large-capacity, high-speed operation, and this significantly

reduces the cost of configuring systems.

1.1.1

Applications

Office automation equipment and digital industrial equipment

R01DS0097EJ0100 Rev.1.00

Apr 22, 2011

Page 1 of 84

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	R5F56106WNBG	R5F56104WNBG	R5F56108WNBG	R5F56107WNBG	R5F56104VNFP	R5F56106VNFP	R5F56107VNFP	R5F56108VNFP
Description	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.	The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation	-	Renesas Electronics Corporation
Parts packaging code	BGA	BGA	BGA	BGA	-	QFP	-	QFP
package instruction	FBGA, BGA176,15X15,32	FBGA, BGA176,15X15,32	FBGA, BGA176,15X15,32	FBGA, BGA176,15X15,32	-	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144	-	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
Contacts	176	176	176	176	-	144	-	144
Reach Compliance Code	compliant	compliant	compliant	compli	-	compli	-	unknow
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	-	3A001.A.3	-	3A001.A.3
Has ADC	YES	YES	YES	YES	-	YES	-	YES
bit size	64	64	64	64	-	64	-	64
CPU series	RX	RX	RX	RX	-	RX	-	RX
maximum clock frequency	100 MHz	100 MHz	100 MHz	100 MHz	-	100 MHz	-	100 MHz
DAC channel	YES	YES	YES	YES	-	YES	-	YES
DMA channel	YES	YES	YES	YES	-	YES	-	YES
JESD-30 code	S-PBGA-B176	S-PBGA-B176	S-PBGA-B176	S-PBGA-B176	-	S-PQFP-G144	-	S-PQFP-G144
Number of terminals	176	176	176	176	-	144	-	144
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	85 °C	-	85 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-	-20 °C	-	-20 °C
PWM channel	YES	YES	YES	YES	-	YES	-	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA	-	LFQFP	-	LFQFP
Encapsulate equivalent code	BGA176,15X15,32	BGA176,15X15,32	BGA176,15X15,32	BGA176,15X15,32	-	QFP144,.87SQ,20	-	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE	-	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	-	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified
RAM (bytes)	131072	131072	131072	131072	-	131072	-	131072
rom(word)	1048576	786432	2097152	1572864	-	1048576	-	2097152
ROM programmability	FLASH	FLASH	FLASH	FLASH	-	FLASH	-	FLASH
speed	100 MHz	100 MHz	100 MHz	100 MHz	-	100 MHz	-	100 MHz
Maximum slew rate	100 mA	100 mA	100 mA	100 mA	-	100 mA	-	-
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	-	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V	-	3 V	-	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	-	3.3 V
surface mount	YES	YES	YES	YES	-	YES	-	YES
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	-	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	-	OTHER	-	OTHER
Terminal form	BALL	BALL	BALL	BALL	-	GULL WING	-	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	0.5 mm	-	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	QUAD	-	QUAD
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	-	MICROCONTROLLER

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