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R5F56104VNFP

Description
The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
File Size1MB,86 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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R5F56104VNFP Overview

The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.

Datasheet
RX610 Group Datasheet
RENESAS 32-Bit MCU
R01DS0097EJ0100
Rev.1.00
Apr 22, 2011
1.
1.1
Overview
Features
The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
One basic instruction is executable in one cycle of the system clock. Calculation functionality is further enhanced, with
the inclusion of a single-precision floating-point calculation unit as well as a 32-bit multiplier and divider. Additionally,
code efficiency is improved by instructions with lengths that are variable in byte units and by an enhanced range of
addressing modes.
Timers, serial communication interfaces, I
2
C bus interfaces, an A/D converter, and a D/A converter are incorporated as
peripheral functions which are essential to embedded devices.
Facilities for connecting external memory are also included, enabling direct connection to memory and peripheral LSI
circuits. The on-chip memory is flash memory capable of large-capacity, high-speed operation, and this significantly
reduces the cost of configuring systems.
1.1.1
Applications
Office automation equipment and digital industrial equipment
R01DS0097EJ0100 Rev.1.00
Apr 22, 2011
Page 1 of 84

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Description The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
Maker - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation
Parts packaging code - BGA BGA BGA BGA QFP - QFP
package instruction - FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 - 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
Contacts - 176 176 176 176 144 - 144
Reach Compliance Code - compliant compliant compliant compli compli - unknow
ECCN code - 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 - 3A001.A.3
Has ADC - YES YES YES YES YES - YES
bit size - 64 64 64 64 64 - 64
CPU series - RX RX RX RX RX - RX
maximum clock frequency - 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz - 100 MHz
DAC channel - YES YES YES YES YES - YES
DMA channel - YES YES YES YES YES - YES
JESD-30 code - S-PBGA-B176 S-PBGA-B176 S-PBGA-B176 S-PBGA-B176 S-PQFP-G144 - S-PQFP-G144
Number of terminals - 176 176 176 176 144 - 144
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C 85 °C - 85 °C
Minimum operating temperature - -20 °C -20 °C -20 °C -20 °C -20 °C - -20 °C
PWM channel - YES YES YES YES YES - YES
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - FBGA FBGA FBGA FBGA LFQFP - LFQFP
Encapsulate equivalent code - BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32 QFP144,.87SQ,20 - QFP144,.87SQ,20
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE - SQUARE
Package form - GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH
power supply - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
RAM (bytes) - 131072 131072 131072 131072 131072 - 131072
rom(word) - 786432 1048576 2097152 1572864 1048576 - 2097152
ROM programmability - FLASH FLASH FLASH FLASH FLASH - FLASH
speed - 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz - 100 MHz
Maximum slew rate - 100 mA 100 mA 100 mA 100 mA 100 mA - -
Maximum supply voltage - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V
Minimum supply voltage - 3 V 3 V 3 V 3 V 3 V - 3 V
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V
surface mount - YES YES YES YES YES - YES
technology - CMOS CMOS CMOS CMOS CMOS - CMOS
Temperature level - OTHER OTHER OTHER OTHER OTHER - OTHER
Terminal form - BALL BALL BALL BALL GULL WING - GULL WING
Terminal pitch - 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm - 0.5 mm
Terminal location - BOTTOM BOTTOM BOTTOM BOTTOM QUAD - QUAD
uPs/uCs/peripheral integrated circuit type - MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER

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