SI32170-B-FM1 datasheet, PDF - EEWORLD Datasheet

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SI32170-B-FM1: DescriptionTelecom Circuit,; CategoryWireless rf/communication Telecom circuit; File Size1MB，64 Pages; ManufacturerSilicon Laboratories Inc

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SI32170-B-FM1 Overview

Telecom Circuit,

SI32170-B-FM1 Parametric

Parameter Name	Attribute value
Maker	Silicon Laboratories Inc
Reach Compliance Code	unknown
Telecom integrated circuit types	TELECOM CIRCUIT

SI32170-B-FM1 Preview

Si3217x

Si3291x

SLIC

INGLE

-C

HIP

FXS S

OLUTION

Si3217x Features

Performs all BORSCHT functions



Ideal for short to medium loops



Global programmability



Simplified configuration and diagnostics





Supported by ProSLIC API



Low power standby operation



W IT H

FXO O

PTION

Tracking dc-dc controller

Patented low-power ringing

Wideband voice support

DTMF detection

Pulse metering

3.3 V operation



Pb-free/RoHS-compliant packaging

Si3291x Features



Greater than 5 kV isolation

Global programmability

Up to +6 dBm TX/RX level



Parallel handset detection

Type I and II caller ID support

Integrated ring detector

Programmable digital hybrid

Applications

Customer Premise Equipment (CPE)



VoIP DSL Gateways and Routers



Wireless Local Loop (WLL)



Ordering Information

Integrated Access Devices (IAD)



Analog Terminal Adapters (ATA)



Small Office/Home Office (SOHO)

PBX



See page 48.

Pin Assignments

Si3217x

EPAD2

RING

VBAT

TIP

Description

The Si3217x is a family of pin-compatible single-channel ProSLIC products that

implement a complete foreign exchange station (FXS) telephony interface solution in

accordance with all relevant LSSGR, ITU, and ETSI specifications. Select parts in

the series also implement Silicon Laboratories' patented capacitive isolation

technology to enable seamless connection to Si3291x series foreign exchange office

(FXO) line-side devices. The Si3217x ProSLIC ICs operate from a 3.3 V supply and

interface to standard PCM/SPI digital interfaces. The Si3217x integrated dc-dc

controller automatically generates the optimal battery voltages required for each line-

state. Si3217x ICs are available with voltage ratings of –110 V or –135 V to support a

wide range of ringing voltages. See the Ordering Guide for the voltage rating of each

Si3217x version. The Si3217x is available in a 5 x 7 mm 42-pin QFN package. The

Si3291x is available in a 16-pin SOIC package.

VDDHV

SDI

SDO

SCLK

SDITHRU

FSYNC

PCLK

INT

C2A/NC

C1A/NC

DTX

DRX

DCFF

42 41 40 39 38 37 36

GPIO1/STIPC

GPIO2/SRINGC

SRINGDC

SRINGAC

STIPAC

STIPDC

VDDA

QGND

IREF

CAPM

CAPP

CAPLB

SVBAT

EPAD2

EPAD1

15 16 17 18 19 20 21

SDCH

VDDREG

VDDD

SDCL

DCDRV

RST

SVDC

Functional Block Diagram

DCT

C1B

C2B

VREG

RNG1

Si3291x

CODEC

ADC

DAC

SLIC

Linefeed

Control

Linefeed

Monitor

DRX

DTX

SDI

SDO

SCLK

INT

RST

DTMF &

Tone Gen

Caller ID

Programmable

AC Impedance

and Hybrid

FSYNC

PCM/

GCI

Interface

TIP

RING

FXS

SPI

Control

Interface

Ringing

Generator

DSP

Optional FXO

Isolation

Interface

C1A

C1B

Isolation

Interface

Line Diagnostics

PLL

DC-DC Controller

C2A

PCLK

Control

C2B

Ring Detect

Off-Hook

CID

BOM

Hybrid and

Termination

DCT

VREG

IGND

TIP

FXO

RING

Si3217x

DCT2

IGND

DCT3

QE2

VREG2

RNG2

Si3291x

Patents pending

Rev. 1.4 3/13

Si3217x/3291x

Si3217x/3291x

Rev. 1.4

Si3217x/3291x

ABLE O F

ONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2. Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

5. FXS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

5.1. DC Feed Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

5.2. Linefeed Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

5.3. Line Voltage and Current Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

5.4. Power Monitoring and Power Fault Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

5.5. Thermal Overload Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

5.6. Loop Closure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.7. Ground Key Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.8. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.9. Polarity Reversal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.10. Two-Wire Impedance Synthesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.11. Transhybrid Balance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.12. Tone Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.13. DTMF Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5.14. Pulse Metering (Si32170/1 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

5.15. DC-DC Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5.16. Wideband Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5.17. In-Circuit and Metallic Loop Testing (MLT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6. FXO Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

6.1. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.2. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.3. In-Circuit Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

6.4. Transmit/Receive Full-Scale Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

6.5. Line Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.6. Loop Current Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.7. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.8. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

6.9. AC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

6.10. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

6.11. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

6.12. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

6.13. Pulse Dialing and Spark Quenching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

6.14. Receive Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

6.15. On-Hook Line Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

6.16. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

7. System Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

7.1. SPI Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Rev. 1.4

Si3217x/3291x

7.2. PCM Interface and Companding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8. Pin Descriptions: Si3217x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

9. Pin Descriptions: Si3291x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

10. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

11. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

12. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

12.1. 42-Pin QFN/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

12.2. 42-Pin QFN/NBA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

13. PCB Land Pattern Si3217x QFN (LGA or NBA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

13.1. QFN PCB Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

13.2. QFN Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

13.3. QFN Stencil Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55

13.4. QFN Card Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

14. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

15. PCB Land Pattern Si3291x SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

16. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

16.1. Si3217x LGA Package Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

16.2. Si3217x LGA Package Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . 59

16.3. Si3217x NBA Package Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

16.4. Si3217x NBA Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

16.5. Si32919 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

16.6. Si3291x Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64

Rev. 1.4

Si3217x/3291x

1. Electrical Specifications

Table 1. Recommended Operating Conditions

Parameter

Ambient Temperature

Silicon Junction Temperature,

QFN-42

Supply Voltage, Si3217x

Battery Voltage, Si32171/6/8

Battery Voltage, Si32170/7/9

Symbol

JHV

DDD

, V

DDA

DDHV

BAT

Test Condition

F-grade

G-grade

Linefeed Die

Min*

–40

—

3.13

–110

–136

Typ

—

3.3

–95

–130

Max*

145

3.47

–15

Unit

°C

Notes:

All minimum and maximum specifications apply across the recommended operating conditions. Typical values apply at

nominal supply voltages and an operating temperature of 25

C unless otherwise stated.

Operation at minimum voltage dependent upon loop conditions and dc-dc converter configuration.

Table 2. Power Supply Characteristics for Si3217x

= 3.3 V, T

= 0 to 70 ºC)

Parameter

Supply Currents:

Reset

Supply Currents:

High Impedance, Open

Supply Currents:

Forward/Reverse, On-hook

Supply Currents:

Forward/Reverse, On-hook

Supply Currents:

Tip/Ring Open, On-hook

Symbol

VBAT

Test Condition

and V

= Hi-Z , RST = 0

and V

= Hi-Z, FXO disabled

Min

—

Typ

9.7

0.0

13.2

0.47

11.2

0.44

27.2

1.4

12.5

0.4

26.3

Max

—

Unit

= –48 V, FXO disabled, Auto-

matic Power Save Mode enabled

= –48 V, FXO disabled, Auto-

matic Power Save Mode

disabled

or V

= –48 V,

or V

= Hi-Z,

FXO disabled, Automatic

Power Save Mode enabled

or V

= –48 V,

or V

= Hi-Z,

FXO disabled, Automatic

Power Save Mode disabled

—

Supply Currents:

Tip/Ring Open, On-hook

VBAT

—

0.95

—

Notes:

LOOP

is the dc current in the subscriber loop during the off-hook state.

= I

DDD

+ I

DDA

+ I

DDC

Refer to AN340 for power supply consumption of the recommended applications circuit, including dc-dc converter.

Rev. 1.4

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SI32170-B-FM1 Related Products

	SI32170-B-FM1	SI32170-B-FM1R	SI32170-B-GM	SI32170-B-GMR	SI32179-B-FM1
Description	Telecom Circuit,	Telecom Circuit,	Telecom Circuit,	Telecom Circuit,	Telecom Circuit,
Maker	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc
Reach Compliance Code	unknown	unknow	unknow	unknow	unknow
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT

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