TLWNF1109(T11)
TOSHIBA LED Lamp
TLWNF1109(T11)
Unit: mm
Panel Circuit Indicators
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3.5 (L) mm × 2.9 (W) mm × 1.9 (H) mm
LED chip and phosphor
Luminous intensity: I
V
= 3200 mcd (typ.) @ I
F
= 40 mA
Color: white (Natural White)
Topr / Tstg = -40 to 100°C
High current driving : I
F
= 50mA (max)
Standard embossed tape packing:
4 mm pitch : T11 type (2000 pcs/reel)
8-mm tape/ reel
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Applications: automotive use, backlighting etc.
Color and Material
Part Number
TLWNF1109
Color
White (Natural White)
Material
InGaN
JEDEC
JEITA
TOSHIBA
―
―
4-3W1
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
(Note 1)
Symbol
I
F
P
D
T
opr
T
stg
Rating
50
200
−40
to 100
−40
to 100
Unit
mA
mW
°C
°C
Weight: 0.035 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
F
– Ta
(mA)
I
F
Allowable forward current
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature
Ta
(°C)
Marktech
Optoelectronics
1
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: info@marktechopto.com
2010-06-03
TLWNF1109(T11)
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Forward Voltage
Reverse Voltage
Symbol
V
F
V
R
Test condition
I
F
=
40 mA
I
R
=
1 mA
Min
3.0
⎯
Typ.
3.5
0.75
Max
4.0
⎯
Unit
V
V
Optical Characteristics
(Ta
=
25°C)
Characteristics
Chromaticity
Luminous Intensity
(Note 3)
Symbol
C
x
C
y
I
V
Test condition
I
F
=
40 mA
I
F
=
40 mA
I
F
=
40 mA
2000
Min
Typ.
(Note 2)
(Note 2)
3200
5000
Max
Unit
⎯
⎯
mcd
Note 2: The product is tested at the following chromaticity coordinate groups.
Accuracy: +/-0.01
0.42
0.4
0.38
0.36
C½
0.34
Point
1
2
3
4
Cx
0.330
0.356
0.361
0.330
Cy
0.318
0.351
0.385
0.360
0.32
0.3
0.28
0.3
0.32
0.34
Cx
0.36
0.38
0.4
Note 3: Iv rank classification
Test conditions: Ta = 25 °C
Product name
TLWNF1109(T11)
XA2
YA1
YA2
Unit
Luminous intensity I
V
Min
2000
2000
2500
3200
Typ.
3200
⎯
⎯
⎯
mcd
Max
5000
3200
4000
5000
mA
40
I
F
The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Let the delivery ratio of each rank be unquestioned.
2
2010-06-03
TLWNF1109(T11)
The cautions
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1 MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application
(ex. Light source for sensor, optical communication and etc) except general display light source.
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2010-06-03
TLWNF1109(T11)
TLWNF1109
I
F
– V
F
(typ.)
100
Ta
=
25°C
3
Ta
=
25°C
1
30
I
V
/I
V
(40 mA) – I
F
(typ.)
(mA)
I
V
/I
V
(40 mA)
2.6
3.0
3.4
3.8
4.2
4.6
5.0
I
F
Forward Current
0.3
10
0.1
3
0.03
1
2.2
0.01
1
3
5
10
30
50
100
300 500
Forward Voltage
V
F
(V)
Forward Current
I
F
(mA)
Relative I
V
– Tc (typ.)
10
0.40
Cx, Cy – I
F
(typ.)
Ta
=
25°C
Relative luminous Intensity I
V
0.38
Chromaticity Cx, Cy
0.36
C
y
0.34
1
C
x
0.32
0.1
-40
-20
0
20
40
60
80
100
0.30
0
10
20
30
40
50
Case Temperature
Tc
(°C)
Forward current
I
F
(mA)
Radiation pattern (typ.)
Ta
=
25°C
20°
30°
40°
50°
60°
70°
80°
90°
10°
0°
Wavelength characteristic (typ.)
1.0
Relative luminous Intensity
10°
20°
30°
40°
50°
60°
70°
80°
90
°
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
300
400
500
600
700
800
Wavelength
λ
(nm)
4
2010-06-03
TLWNF1109(T11)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before
soldering and the device should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 4weeks in an environment of 5°C
to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
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Reflow soldering (example)
Temperature profile for Pb soldering (example)
10 s max
(*)
240°C max
Package surface
temperature (°C)
Temperature profile for Pb-free soldering (example)
5 s max
(*)
260°C max
Package surface
temperature (°C)
(*)
(*)
140~160°C max
(*)
4°C/s max
(*)
4°C/s max
(*)
max
(*)
150~180°C 230°C
4°C/s max
(*)
60~120 s max
(*)
Time
(s)
(*)
4°C/s max
max
(*)
60~120 s
Time
30~50s max
(*)
(s)
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The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
Do not perform wave soldering.
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2010-06-03
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