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MC10LVSX1125D

Description
Support Circuit, 1-Func, ECL, PDSO16, PLASTIC, SOIC-16
CategoryWireless rf/communication    Telecom circuit   
File Size283KB,5 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC10LVSX1125D Overview

Support Circuit, 1-Func, ECL, PDSO16, PLASTIC, SOIC-16

MC10LVSX1125D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionSOP, SOP16,.25
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G16
JESD-609 codee0
length9.9 mm
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum slew rate45 mA
Nominal supply voltage5 V
surface mountYES
technologyECL
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm

MC10LVSX1125D Related Products

MC10LVSX1125D
Description Support Circuit, 1-Func, ECL, PDSO16, PLASTIC, SOIC-16
Is it Rohs certified? incompatible
Maker Motorola ( NXP )
package instruction SOP, SOP16,.25
Reach Compliance Code unknown
JESD-30 code R-PDSO-G16
JESD-609 code e0
length 9.9 mm
Number of functions 1
Number of terminals 16
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code SOP
Encapsulate equivalent code SOP16,.25
Package shape RECTANGULAR
Package form SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED
power supply 5 V
Certification status Not Qualified
Maximum seat height 1.75 mm
Maximum slew rate 45 mA
Nominal supply voltage 5 V
surface mount YES
technology ECL
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb)
Terminal form GULL WING
Terminal pitch 1.27 mm
Terminal location DUAL
Maximum time at peak reflow temperature NOT SPECIFIED
width 3.9 mm
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