|
MIC426CY |
MIC428CY |
MIC427CY |
| Description |
Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS |
Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS |
Buffer/Inverter Based MOSFET Driver, 1.5A, BICMOS |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Micrel ( Microchip ) |
Micrel ( Microchip ) |
Micrel ( Microchip ) |
| package instruction |
DIE, DIE OR CHIP |
DIE, DIE OR CHIP |
DIE, DIE OR CHIP |
| Reach Compliance Code |
unknown |
unknow |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| high side driver |
NO |
NO |
NO |
| Input properties |
STANDARD |
STANDARD |
STANDARD |
| Interface integrated circuit type |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code |
X-XUUC-N6 |
X-XUUC-N6 |
X-XUUC-N6 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Number of functions |
2 |
2 |
2 |
| Number of terminals |
6 |
6 |
6 |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
| Output characteristics |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
| Nominal output peak current |
1.5 A |
1.5 A |
1.5 A |
| Output polarity |
INVERTED |
TRUE AND INVERTED |
TRUE |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
DIE |
DIE |
DIE |
| Encapsulate equivalent code |
DIE OR CHIP |
DIE OR CHIP |
DIE OR CHIP |
| Package shape |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| Package form |
UNCASED CHIP |
UNCASED CHIP |
UNCASED CHIP |
| Peak Reflow Temperature (Celsius) |
240 |
240 |
240 |
| power supply |
4.5/18 V |
4.5/18 V |
4.5/18 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum slew rate |
8 mA |
8 mA |
8 mA |
| Maximum supply voltage |
18 V |
18 V |
18 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
| technology |
BICMOS |
BICMOS |
BICMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal location |
UPPER |
UPPER |
UPPER |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Disconnect time |
0.04 µs |
0.075 µs |
0.075 µs |
| connection time |
0.075 µs |
0.075 µs |
0.04 µs |