Preliminary
GS8152Z18/36/72B-225/200/180/166/150/133
119 and 209 BGA
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• On-chip write parity checking; even or odd selectable
• On-chip parity encoding and error detection
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2M, 4M, and 8M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 119- or 209-Bump BGA package
-225 -200 -180 -166
Flow
t
KQ
7.0 7.5 8.0 8.5
8.5 10.0 10.0 10.0
Through
tCycle
2-1-1-1 Curr (x18) 205 185 185 185
Curr (x36) 240 210 210 210
Curr (x72) 325 285 285 285
2.5 3.0 3.2 3.5
Pipeline
t
KQ
4.4 5.0 5.5 6.0
3-1-1-1
tCycle
Curr (x18) 350 315 290 270
Curr (x36) 410 370 340 315
Curr (x72) 570 515 470 435
-150
10.0
10.0
185
210
285
3.8
6.7
250
290
400
-133
11.0
15.0
140
160
205
4.0
7.5
230
260
360
Unit
ns
ns
mA
mA
mA
ns
ns
mA
mA
mA
16Mb Pipelined and Flow Through
225MHz–133MHz
3.3 V V
DD
Synchronous NBT SRAM
2.5 V or 3.3 V I/O
Functional Description
The GS8152Z18/36/72B is a 16Mbit Synchronous Static
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or
other pipelined read/double late write or flow through read/
single late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8152Z18/36/72B may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8152Z18/36/72B is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
Standard 119-bump (x18 & x36) or 209-bump (x72) BGA
package.
Flow Through and Pipelined NBT SRAM Back-to-Back Read/Write Cycles
Clock
Address
Read/Write
A
R
B
W
Q
A
C
R
D
B
Q
A
D
W
Q
C
D
B
E
R
D
D
Q
C
F
W
Q
E
D
D
Q
E
Flow Through
Data I/O
Pipelined
Data I/O
Rev: 1.01 11/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
1/39
© 2000, Giga Semiconductor, Inc.
NoBL is a trademark of Cypress Semiconductor Corp.. NtRAM is a trademark of Samsung Electronics Co.. ZBT is a trademark of Integrated Device Technology, Inc.
Preliminary
GS8152Z18/36/72B-225/200/180/166/150/133
GS8152Z72 Pad Out
209-Bump BGA—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Rev 9.7
DQG5
DQG6
DQG7
DQG8
DQG9
DQC4
DQC3
DQC2
DQC1
NC
DQH1
DQH2
DQH3
DQH4
DQD9
DQD8
DQD7
DQD6
DQD5
2
DQG1
DQG2
DQG3
DQG4
DQC9
DQC8
DQC7
DQC6
DQC5
NC
DQH5
DQH6
DQH7
DQH8
DQH9
DQD4
DQD3
DQD2
DQD1
3
A13
BC
BH
V
SS
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
CK
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
V
SS
NC
A9
TMS
4
E2
BG
BD
NC
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
NC
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
NC
A12
A8
TDI
5
A14
NC
NC
NC
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
NC
NC
A7
A3
6
ADV
W
E1
G
V
DD
ZQ
MCH
MCL
MCH
MCL
FT
MCL
MCH
ZZ
V
DD
LBO
A11
A1
A0
7
A15
A16
NC
NC
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
PE
NC
A6
A2
8
E3
BB
BE
NC
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
NC
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
NC
A10
A5
TDO
9
A17
BF
BA
V
SS
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
DP
V
DDQ
V
SS
V
DDQ
V
SS
V
DDQ
V
SS
NC
A4
TCK
10
DQB1
DQB2
DQB3
DQB4
DQF9
DQF8
DQF7
DQF6
DQF5
NC
DQA5
DQA6
DQA7
DQA8
DQA9
DQE4
DQE3
DQE2
DQE1
11
DQB5
DQB6
DQB7
DQB8
DQB9
DQF4
DQF3
DQF2
DQF1
QE
DQA1
DQA2
DQA3
DQA4
DQE9
DQE8
DQE7
DQE6
DQE5
11 x 19 Bump BGA—14 x 22 mm
2
Body—1 mm Bump Pitch
Rev: 1.01 11/2000
2/39
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8152Z18/36/72B-225/200/180/166/150/133
GS8152Z72 BGA Pin Description
Pin Location
W6, V6
W7, W5, V9, V8, V7, V5, V4, V3, U8, U7, U6,
U5, U4, A3, A5, A7, B7, A9
L11, M11, N11, P11, M10, N10, P10, R10
A10, B10, C10, D10, A11, B11, C11, D11, E11
J1, H1, G1, F1, J2, H2, G2, F2, E2
W2, VV2, U2, T2, W1, V1, U1, T1, R1
W10, V10, U10, T10, W11, V11, U11, T11, R11
J11, H11, G11, F11, J10, H10, G10, F10, E10
A2, B2, C2, D2, A1, B1, C1, D1, E1
L1, M1, N1, P1, L2, M2, N2, P2, R2
C9, B8, B3, C4, C8, B9, B4, C3
B5, C5, C7, D4, D5, D8, K1, K2, K4, K8, K10,
T4, T5, T8, U3, U5, U7, U9
K3
B6
C6, A8
A4
D6
A7
P6
L6
T6
G6, J6, N6
H6, K6, M6
T7
Symbol
A
0
, A
1
An
DQ
A1
–DQ
A9
DQ
B1
–DQ
B9
DQ
C1
–DQ
C9
DQ
D1
–DQ
D9
DQ
E1
–DQ
E9
DQ
F1
–DQ
F9
DQ
G1
–DQ
G9
DQ
H1
–DQ
H9
B
A
, B
B
, B
C
,B
D,
B
E
, B
F
, B
G
,B
H
NC
CK
W
E
1,
E
3
E
2
G
ADV
ZZ
FT
LBO
MCH
MCL
PE
Type
I
I
Description
Address field LSBs and Address Counter Preset Inputs
Address Inputs
I/O
Data Input and Output pins (x36 Version)
I
—
I
I
I
I
I
I
I
I
I
I
Byte Write Enable for DQ
A
, DQ
B
, DQ
C
, DQ
D,
DQ
E
,
DQ
F
, DQ
G
, DQ
H
I/Os; active low
No Connect
Clock Input Signal; active high
Write Enable. Writes all enabled bytes; active low
Chip Enable; active low
Chip Enable; active high
Output Enable; active low
Burst address counter advance enable; active low
Sleep Mode control; active high
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Must Connect High
Must Connect Low
Parity Bit Enable; active low (High = x16/32 Mode, Low = x18/36
Mode)
I
Rev: 1.01 11/2000
3/39
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8152Z18/36/72B-225/200/180/166/150/133
GS8152Z72 BGA Pin Description
Pin Location
K9
K11
F6
W2
W4
W8
W9
E5, E6, E7, G5, G7, J5, J7, L5, L7, N5, N7, R5,
R6, R7
C3, C9, F3, F4, F5, F7, F8, F9, H3, H4, H5, H7,
H8, H9, K5, K7, M3, M4, M5, M7, M8, M9, P3,
P4, P5, P7, P8, P9, T3, T9
E3, E4, E8, E0, G3, G4, G8, G9, J3, J4, J8, J9,
L3, L4, L8, L9, N3, N4, N8, N9, R3, R4, R8, R9
Symbol
DP
QE
ZQ
TMS
TDI
TDO
TCK
V
DD
V
SS
V
DDQ
Type
I
O
I
I
I
O
I
I
I
I
Description
Data Parity Mode Input; 1 = Even, 0 = Odd
Parity Error Out; Open Drain Output
FLXDrive Output Impedance Control
(Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
Scan Test Mode Select
Scan Test Data In
Scan Test Data Out
Scan Test Clock
Core power supply
I/O and Core Ground
Output driver power supply
Rev: 1.01 11/2000
4/39
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8152Z18/36/72B-225/200/180/166/150/133
GS8152Z36 Pad Out
119 Bump BGA—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQ
C4
DQ
C3
V
DDQ
DQ
C2
DQ
C1
V
DDQ
DQ
A1
DQ
A2
V
DDQ
DQ
A3
DQ
A4
NC
NC
V
DDQ
2
A
6
E
2
A
5
DQ
C9
DQ
C8
DQ
C7
DQ
C6
DQ
C5
V
DD
DQ
A5
DQ
A6
DQ
A7
DQ
A8
DQ
A9
A
2
NC
TMS
3
A
7
A
4
A
3
V
SS
V
SS
V
SS
B
C
V
SS
DP
V
SS
B
D
V
SS
V
SS
V
SS
LBO
A
10
TDI
4
A
18
ADV
V
DD
ZQ
E
1
G
A
17
W
V
DD
CK
NC
CKE
A
1
A
0
V
DD
A
11
TCK
5
A
8
A
15
A
14
V
SS
V
SS
V
SS
B
B
V
SS
QE
V
SS
B
A
V
SS
V
SS
V
SS
FT
A
12
TDO
6
A
9
E
3
A
16
DQ
B9
DQ
B8
DQ
B7
DQ
B6
DQ
B5
V
DD
DQ
A5
DQ
A6
DQ
A7
DQ
A8
DQ
A9
A
13
NC
NC
7
V
DDQ
NC
NC
DQ
B4
DQ
B3
V
DDQ
DQ
B2
DQ
B1
V
DDQ
DQ
A1
DQ
A2
V
DDQ
DQ
A3
DQ
A4
PE
ZZ
V
DDQ
Rev: 1.01 11/2000
5/39
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.