SA8281/IG/DP1S datasheet, PDF - EEWORLD Datasheet

SA8281/IG/DP1S: Description1 Func, CMOS, PDIP28, PLASTIC, DIP-28; CategoryAnalog mixed-signal IC The signal circuit; File Size803KB，14 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/

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SA8281/IG/DP1S Overview

1 Func, CMOS, PDIP28, PLASTIC, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Zarlink Semiconductor (Microsemi)
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
ECCN code	EAR99
Analog Integrated Circuits - Other Types	PULSE
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
Number of functions	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

Obsolescence Notice

This product is obsolete.

This information is available for your

convenience only.

For more information on

Zarlink’s obsolete products and

replacement product lists, please visit

http://products.zarlink.com/obsolete_products/

	SA8281/IG/DP1S	SA8281/IG/MP1S	SA8282/IG/DP1S
Description	1 Func, CMOS, PDIP28, PLASTIC, DIP-28	1 Func, CMOS, PDSO28, PLASTIC, SOIC-28	1 Func, CMOS, PDIP28, PLASTIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DIP, DIP28,.6	SOP, SOP28,.4	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
Analog Integrated Circuits - Other Types	PULSE	PULSE	PULSE
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28
JESD-609 code	e0	e0	e0
Number of functions	1	1	1
Number of terminals	28	28	28
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP
Encapsulate equivalent code	DIP28,.6	SOP28,.4	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.64 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
width	15.24 mm	7.5 mm	15.24 mm
Maker	Zarlink Semiconductor (Microsemi)	-	Zarlink Semiconductor (Microsemi)

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