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709004500000

Description
Board Connector, 4 Contact(s), 1 Row(s), Female, Right Angle, 0.039 inch Pitch, Surface Mount Terminal, Locking, Plug
CategoryThe connector    The connector   
File Size158KB,2 Pages
ManufacturerW+P Products GmbH
Download Datasheet Parametric View All

709004500000 Overview

Board Connector, 4 Contact(s), 1 Row(s), Female, Right Angle, 0.039 inch Pitch, Surface Mount Terminal, Locking, Plug

709004500000 Parametric

Parameter NameAttribute value
MakerW+P Products GmbH
Reach Compliance Codecompliant
body width0.087 inch
subject depth0.138 inch
body length0.197 inch
Body/casing typePLUG
Connector typeBOARD CONNECTOR
Contact to complete cooperationAU ON NI
Contact completed and terminatedTIN
Contact point genderFEMALE
Contact materialBERYLLIUM COPPER
contact modeRECTANGULAR
Contact resistance10 mΩ
Contact styleMACHINE SCREW
Dielectric withstand voltage700VAC V
Insulation resistance10000000000 Ω
insulator materialTHERMOPLASTIC
Manufacturer's serial number7090
Plug contact pitch0.039 inch
Installation option 1LOCKING
Installation methodRIGHT ANGLE
Installation typeBOARD
Number of connectorsONE
PCB row number1
Number of rows loaded1
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
Rated current (signal)1 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch0.9906 mm
Termination typeSURFACE MOUNT
Total number of contacts4

709004500000 Preview

7090
SMT-Buchsenleisten RM 1,00mm
SMT Female Header Pitch 1,00mm
Technische Daten /Technical
Data
Isolierkörper
Thermoplastischer Kunststoff, nach UL94 V-0
Insulator
Thermoplastic, rated UL94 V-0
Kontaktmaterial
Hülse: Messing gedreht
Feder: 4-Lamellen-Clip, Beryllium-Kupfer
Contact Material
Sleeve: screw machined brass
Clip: 4 Finger-Clip, Beryllium-Copper
Kontaktoberfläche
Lt. Oberflächenoptionen, über Ni (1,3 ... 2,5µm)
Contact Surface
Acc. to options (see below), over Ni (1,3 ... 2,5µm)
Lötbarkeit
IEC512-12A
Solderability
IEC512-12A
Durchgangswiderstand
< 10mΩ
Contact Resistance
< 10mΩ
10
Isolationswiderstand
> 10
10
Insulation Resistance
> 10
Spannungsfestigkeit
500V
RMS
Test Voltage
500V
RMS
Nennspannung
100V
RMS
; 150V
DC
Voltage Rating
100V
RMS
; 150V
DC
Nennstrom
1A
Current Rating
1A
Temperaturbereich
-55°C ... +125°C
Temperature Range
-55°C ... +125°C
Verarbeitung
Reflow-Lötverfahren; weitere Informationen in Kapitel T
Processing
Reflow-soldering, detailed information in ch. T
Einsetzbar für Rundstift 0,36 ... 0,46mm.
Accepts 0,36 ... 0,46mm round pin.
Series
Contacts
*
Sleeve Plating
Clip Plating
Packing
*
7090
10
02-50
50
50
Hülse verzinnt
Tin plated sleeve
00
00
Vergoldet
Gold plated
ST
00
ST
(TR)
(
*
Bestellbeispiel - Bitte durch Ihre
Spezifikationen ersetzen.
*
Order example - To be replaced by your
specifications.)
TEL.: +49 5223 98507-0
FAX.: +49 5223 98507-50
Lieferformen /
Packing Options:
00
= Schüttgut /
Bulk Good
ST
= In Stangen /
In tubes
(TR)
= Tape & Reel auf Anfrage /
Tape & Reel by request
E-MAIL: sales@wppro.com
INTERNET: www.wppro.com
1
© W+P PRODUCTS
Informationen zum Reflow-Lötverfahren
Reflow-Soldering Information
Reflow-Lötverfahren
Reflow-Soldering
Bauteile sollten gemäß folgendem Temperatur-Profil in
Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies
Löten im Reflowverfahren verarbeitet werden (Maximalwerte)
Profil Eigenschaft
Durchschnitts-Ramp-Up Rate (Ts
max
to Tp)
Vorheizen
- Temperatur Min (Ts
min
)
- Temperatur Max (Ts
max
)
- Zeit (ts
min
auf ts
max
)
Verbleiben oberhalb:
- Temperatur (T
L
)
- Zeit (t
L
)
Peak/Klassifizierung Temperatur (Tp)
Zeit innerhalb von 5°C um die Peak-Temperatur (tp)
Ramp-Down Rate
Zeit von 25°C bis zur Peak-Temperatur
Bleifreies Löten
3°C / Sek. Max.
150°C
200°C
60-180 Sekunden
217°C
60-180 Sekunden
260°C +/- 5°C
20-40 Sekunden
6°C / Sekunde max.
8 Minuten max.
Items should be soldered according to IPC/JEDEC J-
STD-020C temperature-profile for leadfree reflow-soldering
(maximum values):
Profile Feature
Average Ramp-Up Rate (Ts
max
to Tp)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (ts
min
auf ts
max
)
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak/Classification Temperature (Tp)
Time within 5°C of actual Peak-Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
PB-Free assembly
3°C / second max.
150°C
200°C
60-180 seconds
217°C
60-180 seconds
260°C +/- 5°C
20-40 seconds
6°C / second max.
8 minutes max.
Empfohlenes Reflow-Lötprofil:
Recommended Reflow-Soldering profile:
TEL.: +49 5223 98507-0
FAX.: +49 5223 98507-50
2
E-MAIL: sales@wppro.com
INTERNET: www.wppro.com
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