FRE160D, FRE160R,
FRE160H
June 1998
41A, 100V, 0.050 Ohm, Rad Hard,
N-Channel Power MOSFETs
Package
TO-258AA
Features
• 41A, 100V, RDS(on) = 0.050
Ω
• Second Generation Rad Hard MOSFET Results From New Design Concepts
• Gamma
-
-
-
-
-
Meets Pre-Rad Specifications to 100KRAD(Si)
Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)
Performance Permits Limited Use to 3000KRAD(Si)
Survives 3E9RAD(Si)/sec at 80% BVDSS Typically
Survives 2E12 Typically If Current Limited to IDM
• Gamma Dot
• Photo Current
• Neutron
- 10nA Per-RAD(Si)/sec Typically
- Pre-RAD Specifications for 3E13 Neutrons/cm
2
- Usable to 3E14 Neutrons/cm
2
Description
The Intersil has designed a series of SECOND GENERATION hardened power
MOSFETs of both N and P channel enhancement types with ratings from 100V to
500V, 1A to 60A, and on resistance as low as 25m
Ω
. Total dose hardness is
offered at 100K RAD(Si) and 1000KRAD(Si) with neutron hardness ranging from
1E13 for 500V product to 1E14 for 100V product. Dose rate hardness (GAMMA
DOT) exists for rates to 1E9 without current limiting and 2E12 with current limiting.
This MOSFET is an enhancement-mode silicon-gate power field effect transistor of
the vertical DMOS (VDMOS) structure. It is specially designed and processed to
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n
o
)
exposures. Design and processing efforts are also directed to enhance survival to
heavy ion (SEU) and/or dose rate (GAMMA DOT) exposure.
This part may be supplied as a die or in various packages other than shown above.
Reliability screening is available as either non TX (commercial), TX equivalent of
MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of
MIL-S-19500. Contact the Intersil High-Reliability Marketing group for any desired
deviations from the data sheet.
Symbol
Absolute Maximum Ratings
(TC = +25
o
C) Unless Otherwise Specified
FRE160D, R, H
100
100
41
26
100
±
20
150
60
1.20
100
41
100
-55 to +150
300
UNITS
V
V
A
A
A
V
W
W
W/
o
C
A
A
A
o
C
o
C
FRE160D, FRE160R, FRE160H Rev. A
Drain-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS
Drain-Gate Voltage (RGS = 20k
Ω
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Maximum Power Dissipation
TC = +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
TC = +100
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
Derated Above +25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inductive Current, Clamped, L = 100
µ
H, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . . . ILM
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM
Operating And Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG
Lead Temperature (During Soldering)
Distance > 0.063 in. (1.6mm) From Case, 10s Max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
©2001 Fairchild Semiconductor Corporation
FRE160D, FRE160R, FRE160H
Pre-Radiation Electrical Specifications
TC = +25
o
C, Unless Otherwise Specified
LIMITS
PARAMETER
Drain-Source Breakdown Volts
Gate-Treshold Volts
Gate-Body Leakage Forward
Gate-Body Leakage Reverse
Zero-Gate Voltage
Drain Current
Rated Avalanche Current
Drain-Source On-State Volts
Drain-Source On Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate-Charge Threshold
Gate-Charge On State
Gate-Charge Total
Plateau Voltage
Gate-Charge Source
Gate-Charge Drain
Diode Forward Voltage
Reverse Recovery Time
Junction-To-Case
Junction-To-Ambient
SYMBOL
BVDSS
VGS(th)
IGSSF
IGSSR
IDSS1
IDSS2
IDSS3
IAR
VDS(on)
RDS(on)
td(on)
tr
td(off)
tf
QG(th)
QG(on)s
QGM
VGP
QGS
QGD
VSD
TT
R
θ
jc
R
θ
ja
ID = 41A, VGD = 0
I = 41A; di/dt = 100A/
µ
s
-
Free Air Operation
VDD = 50V, ID = 41A
IGS1 = IGS2
0
≤
VGS
≤
20
TEST CONDITIONS
VGS = 0, ID = 1mA
VDS = VGS, ID = 1mA
VGS = +20V
VGS = -20V
VDS = 100V, VGS = 0
VDS = 80V, VGS = 0
VDS = 80V, VGS = 0,TC = +125
o
C
Time = 20
µ
s
VGS = 10V, ID = 41A
VGS = 10V, ID = 26A
VDD = 50V, ID = 41A
Pulse Width = 3
µ
s
Period = 300
µ
s Rg = 10
Ω
0
≤
VGS
≤
10 (See Test Circuit)
MIN
100
2.0
-
-
-
-
-
-
-
-
-
-
-
-
4
94
182
3
21
52
0.6
-
-
-
MAX
-
4.0
100
100
1
0.025
0.25
100
2.15
0.050
100
700
ns
400
300
16
376
728
16
86
nc
210
1.8
600
0.83
48
V
ns
o
C/W
UNITS
V
V
nA
nA
mA
A
V
Ω
nc
V
V
DD
ELECTRONIC SWITCH OPENS
WHEN I
AS
IS REACHED
V
DS
L
V
DS
+
CURRENT I
TRANSFORMER
AS
R
L
-
V
GS
= 12V
DUT
0V
R
GS
0V
t
P
50Ω
VARY t
P
TO OBTAIN
REQUIRED PEAK I
AS
V
GS
≤
20V
DUT
50Ω
+
V
DD
-
50V-150V
FIGURE 1. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 2. UNCLAMPED ENERGY TEST CIRCUIT
©2001 Fairchild Semiconductor Corporation
FRE160D, FRE160R, FRE160H Rev. A
FRE160D, FRE160R, FRE160H
Post-Radiation Electrical Specifications
TC = +25
o
C, Unless Otherwise Specified
LIMITS
PARAMETER
Drain-Source
Breakdown Volts
(Note 4,6)
(Note 5,6)
Gate-Source
Threshold Volts
(Note 4,6)
(Note 3,5,6)
Gate-Body
Leakage Forward
(Note 4,6)
(Note 5,6)
Gate-Body
Leakage Reverse
(Note 2,4,6)
(Note 2,5,6)
Zero-Gate Voltage
Drain Current
(Note 4,6)
(Note 5,6)
Drain-Source
On-State Volts
(Note 1,4,6)
(Note 1,5,6)
Drain-Source
On Resistance
(Note 1,4,6)
(Note 1,5,6)
NOTES:
1. Pulse test, 300
µ
s max
2. Absolute value
3. Gamma = 300KRAD(Si)
4. Gamma = 10KRAD(Si) for “D”, 100KRAD(Si) for “R”. Neutron = 3E13
5. Gamma = 1000KRAD(Si). Neutron = 3E13
6. Insitu Gamma bias must be sampled for both VGS = +10V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS
7. Gamma data taken 6/11/89 on TA 17661 devices by GE ASTRO SPACE; EMC/SURVIVABILITY LABORATORY; KING OF PRUSSIA,
PA 19401
8. Single event drain burnout testing by Titus, J.L., et al of NWSC, Crane, IN at Brookhaven Nat. Lab. Dec 11-14, 1989
9. Neutron derivation, INTERSIL Application note AN-8831, Oct. 1988
SYMBOL
BVDSS
BVDSS
VGS(th)
VGS(th)
IGSSF
IGSSF
IGSSR
IGSSR
IDSS
IDSS
VDS(on)
VDS(on)
RDS(on)
RDS(on)
TYPE
FRE160D, R
FRE160H
FRE160D, R
FRE160H
FRE160D, R
FRE160H
FRE160D, R
FRE160H
FRE160D, R
FRE160H
FRE160D, R
FRE160H
FRE160D, R
FRE160H
TEST CONDITIONS
VGS = 0, ID = 1mA
VGS = 0, ID = 1mA
VGS = VDS, ID = 1mA
VGS = VDS, ID = 1mA
VGS = 20V, VDS = 0
VGS = 20V, VDS = 0
VGS = -20V, VDS = 0
VGS = -20V, VDS = 0
VGS = 0, VDS = 80V
VGS = 0, VDS = 80V
VGS = 10V, ID = 41A
VGS = 16V, ID = 41A
VGS = 10V, ID = 26A
VGS = 14V, ID = 26A
MIN
100
95
2.0
1.5
-
-
-
-
-
-
-
-
-
-
MAX
-
-
4.0
4.5
100
200
100
200
25
100
2.15
3.23
.050
.075
UNITS
V
V
V
V
nA
nA
nA
nA
µ
A
µ
A
V
V
Ω
Ω
©2001 Fairchild Semiconductor Corporation
FRE160D, FRE160R, FRE160H Rev. A
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