Microprocessor Circuit, CMOS, PQFP100, QFP-100
| Parameter Name | Attribute value |
| Maker | Intel |
| Parts packaging code | QFP |
| package instruction | QFP, |
| Contacts | 100 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-PQFP-G100 |
| length | 20 mm |
| Number of terminals | 100 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Maximum seat height | 3.3 mm |
| surface mount | YES |
| technology | CMOS |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| width | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |

| 82438VX | 82437VX | |
|---|---|---|
| Description | Microprocessor Circuit, CMOS, PQFP100, QFP-100 | DRAM Controller, 4M X 64, CMOS, PQFP208, QFP-208 |
| Parts packaging code | QFP | QFP |
| package instruction | QFP, | FQFP, |
| Contacts | 100 | 208 |
| Reach Compliance Code | compliant | unknown |
| JESD-30 code | R-PQFP-G100 | S-PQFP-G208 |
| length | 20 mm | 28 mm |
| Number of terminals | 100 | 208 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | FQFP |
| Package shape | RECTANGULAR | SQUARE |
| Package form | FLATPACK | FLATPACK, FINE PITCH |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 3.3 mm | 4.25 mm |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.5 mm |
| Terminal location | QUAD | QUAD |
| width | 14 mm | 28 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MEMORY CONTROLLER, DRAM |