LMV225TL datasheet, PDF - EEWORLD Datasheet

LMV225TL: DescriptionTELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4; CategoryWireless rf/communication Telecom circuit; File Size2MB，39 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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LMV225TL Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DSBGA
package instruction	VFBGA,
Contacts	4
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	S-PBGA-B4
length	1.014 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	4
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	0.675 mm
Nominal supply voltage	2.7 V
surface mount	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	1.014 mm

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