Schottky PowerMod
CPT30060
Baseplate
A=Common Anode
B
A
R
G
Dim. Inches
Min.
A
B
C
E
F
G
H
N
Q
R
U
V
W
Millimeters
Min.
Max.
Notes
Max.
Q
N
W
Baseplate
Common Cathode
U
C
F
U
H
V
E
Baseplate
D=Doubler
Notes:
Baseplate: Nickel plated
copper
---
3.630
0.800
0.700
0.630
---
0.130
0.120
0.510
0.490
1.375 BSC
---
0.010
---
---
0.290
0.275
3.150 BSC
0.600
---
0.312
.340
0.180
0.195
---
92.20
17.78
20.32
---
16.00
3.30
3.05
12.45
12.95
34.92 BSC
---
0.25
---
---
6.99
7.37
80.01 BSC
15.24
---
7.92
8.64
4.57
4.95
1/4-20
Dia.
Dia.
Microsemi
Catalog Number
CPT30060*
Industry
Part Number
MBRP20060CT
MBRP30060CT
MBR20060CT
MBR30060CT
Working Peak
Repetitive Peak
Reverse Voltage Reverse Voltage
60V
60V
Schottky Barrier Rectifier
Guard Ring Protection
300 Amperes/60 Volts
175°C Junction Temperature
Reverse Energy Tested
ROHS Compliant
*Add Suffix A for Common Anode, D for Doubler
Electrical Characteristics
I F(AV) 300 Amps
Average forward current per pkg
I F(AV) 150 Amps
Average forward current per leg
I FSM
2000 Amps
Maximum surge current per leg
Maximum repetitive reverse current per leg I R(OV) 2 Amps
VFM
.82 Volts
Max peak forward voltage per leg
VFM
.68 Volts
Max peak forward voltage per leg
I RM
75 mA
Max peak reverse current per leg
I RM
Max peak reverse current per leg
4.0 mA
CJ
Typical junction capacitance per leg
4300 pF
TC = 127°C, Square wave, R 0JC = 0.20°C/W
T C = 127°C, Square wave, R 0JC = 0.40°C/W
8.3ms, half sine,T J = 175°C
f = 1 KHZ, 25°C, 1µsec square wave
I FM = 200A: J = 25°C*
T
I FM = 200A: J = 175°C*
T
VRRM, TJ = 125°C*
VRRM, TJ = 25°C
VR = 5.0V,TC = 25°C
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Max thermal resistance per pkg
Typical thermal resistance (greased)
Terminal Torque
Mounting Base Torque (outside holes)
Mounting Base Torque (center hole)
center hole must be torqued first
Weight
T STG
TJ
R OJC
R OJC
R OCS
-55°C to 175°C
-55°C to 175°C
0.40°C/W Junction to case
0.20°C/W Junction to case
0.08°C/W Case to sink
35-50 inch pounds
30-40 inch pounds
8-10 inch pounds
2.8 ounces (75 grams) typical
www.microsemi.com
October, 2012 - Rev. 7
CPT30060
Figure 1
Typical Forward Characteristics - Per Leg
1000
800
600
Junction Capacitance - pF
400
Figure 3
Typical Junction Capacitance - Per Leg
100,000
60,000
40,000
20,000
10,000
6000
4000
2000
1000
0.1
200
175 C
25 C
100
80
60
40
Instantaneous Forward Current - Amperes
0.5
1.0
5.0
10
50
100
Reverse Voltage - Volts
Figure 4
20
Maximum Allowable Case Temperature - C
Forward Current Derating - Per Leg
175
165
155
145
135
125
115
105
60
0
40
80
90
120
120
180
160
DC
200
10
8.0
6.0
4.0
2.0
1.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage - Volts
Average Forward Current - Amperes
Figure 2
Typical Reverse Characteristics - Per Leg
1000
Typical Reverse Current - mA
100
10
1.0
0.1
.01
125 C
75 C
25 C
0
10
20
30
40
50
60
175 C
Maximum Power Dissipation - Watts
Figure 5
Maximum Forward Power Dissipation - Per Leg
175
150
125
100
75
50
25
0
0
40
80
120
160
200
Average Forward Current - Amperes
60
120
90
DC
180
Reverse Voltage - Volts
www.microsemi.com
October, 2012 - Rev. 7
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
www.microsemi.com
October, 2012
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
