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Datasheet> All Categories > Analog mixed-signal IC> Drivers and interfaces> HI-8383C-M-01
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HI-8383C-M-01

Description
Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size92KB，9 Pages
ManufacturerHolt Integrated Circuits
Websitehttp://www.holtic.com/
Environmental Compliance  
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HI-8383C-M-01 Overview

Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16

HI-8383C-M-01 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?incompatible
MakerHolt Integrated Circuits
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
ECCN codeEAR99
Differential outputYES
Number of drives1
High level input current maximum value0.000001 A
Input propertiesDIFFERENTIAL
Interface integrated circuit typeLINE DRIVER
Interface standardsARINC 429
JESD-30 codeR-CDIP-T16
JESD-609 codee0
length20.57 mm
Number of functions1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Minimum output swing9.5 V
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5,+-12/+-15 V
Certification statusNot Qualified
Maximum receive delay
Maximum seat height5.08 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
Supply voltage 1-max15 V
Mains voltage 1-minute12 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
maximum transmission delay3000 ns
width7.62 mm

HI-8383C-M-01 Preview

HI-8382, HI-8383
September 2011
ARINC 429
Differential Line Driver
PIN CONFIGURATION
VREF
1
STROBE
2
SYNC
3
DATA(A)
4
CA
5
AOUT
6
-V
7
GND
8
GENERAL DESCRIPTION
The HI-8382 and HI-8383 bus interface products are silicon
gate CMOS devices designed as a line driver in accordance
with the ARINC 429 bus specifications.
Inputs are provided for clocking and synchronization. These
signals are AND'd with the DATA inputs to enhance system
performance and allow the HI-8382 to be used in a variety of
applications. Both logic and synchronization inputs feature
built-in 2,000V minimum ESD input protection as well as TTL
and CMOS compatibility.
The differential outputs of the HI-8382 are independently
programmable to either the high speed or low speed ARINC
429 output rise and fall time specifications through the use of
two external capacitors. The output voltage swing is also
adjustable by the application of an external voltage to the VREF
input. The HI-8382 has on-chip Zener diodes in series with a
fuse to each differential output protecting the ARINC bus from
an overvoltage failure. The outputs each have a series
resistance of 37.5 ohms. The HI-8383 is identical to the HI-
8382 except that the series resistors are 13 ohms and the
overvoltage protection circuitry has been eliminated.
The updated HI-318X and HI-8585 ARINC 429 line drivers are
recommended for all new designs where logic signals must be
converted to ARINC 429 levels such as a user ASIC, the
HI-3282 or HI-8282A ARINC 429 Serial Transmitter/Dual
Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the
HI-8783 ARINC interface device. Holt products are readily
available for both industrial and military applications. Please
contact the Holt Sales Department for additional information,
including data sheets for any of the Holt products mentioned
above.
(Top View)
16
V1
15
N/C
14
CLOCK
13
DATA(B)
12
CB
11
BOUT
10
N/C
9
+V
HI-8382C / CT / CM-01 / CM-03
SMD # 5962-8687901EA
16 - PIN CERAMIC SIDE-BRAZED DIP
(See Page 6 for additional package pin configurations)
FUNCTION
+
_
HI-8382
ARINC 429 DIFFERENTIAL LINE DRIVER
FEATURES
!
Low power CMOS
!
TTL and CMOS compatible inputs
!
Programmable output voltage swing
!
Adjustable ARINC rise and fall times
!
Operates at data rates up to 100 Kbits
!
Overvoltage protection
!
Industrial and extended temperature ranges
!
DSCC SMD part number
TRUTH TABLE
SYNC CLOCK DATA(A) DATA(B) AOUT
X
L
H
H
H
H
L
X
H
H
H
H
X
X
L
L
H
H
X
X
L
H
L
H
0V
0V
0V
-V
REF
+V
REF
0V
BOUT COMMENTS
0V
0V
0V
+V
REF
-V
REF
0V
NULL
NULL
NULL
LOW
HIGH
NULL
( DS8382 Rev. F )
HOLT INTEGRATED CIRCUITS
www.holtic.com
09/11
HI-8382, HI-8383
FUNCTIONAL DESCRIPTION
The SYNC and CLOCK inputs establish data synchronization
utilizing two AND gates, one for each data input. Each logic
input, including the power enable (STROBE) input, are
TTL/CMOS compatible. Besides reducing chip current drain,
STROBE also floats each output. However the overvoltage
fuses and diodes of the HI-8382 are not switched out.
Figure 1 illustrates a typical ARINC 429 bus application.
Three power supplies are necessary to operate the HI-8382;
typically +15V, -15V and +5V. The chip also works with ±12V
supplies. The +5V supply can also provide a reference
voltage that determines the output voltage swing. The
differential output voltage swing will equal 2V
REF
. If a value of
V
REF
other than +5V is needed, a separate +5V power supply
is required for pin V
1
.
With the DATA (A) input at a logic high and DATA (B) input at a
logic low, A
OUT
will switch to the +V
REF
rail and B
OUT
will
switch to the -V
REF
rail (ARINC HIGH state). With both data
input signals at a logic low state, the outputs will both switch to
0V (ARINC NULL state).
The driver output impedance, R
OUT
, is nominally 75 ohms.
The rise and fall times of the outputs can be calibrated through
the selection of two external capacitor values that are
connected to the C
A
and C
B
input pins. Typical values for
high-speed operation (100KBPS) are C
A
= C
B
= 75pF and for
low-speed operation (12.5 to 14KBPS) C
A
= C
B
= 500pF.
The driver can be externally powered down by applying a logic
high to the STROBE input pin. If this feature is not being used,
the pin should be tied to ground.
The C
A
and C
B
pins are inputs to unity gain amplifiers.
Therefore they must be allowed to swing to -5V. Provision to
V
REF
+V
C
A
switch capacitors must be done with analog switches that
allow voltages below their ground.
Both ARINC outputs of the HI-8382 are protected by internal
fuses capable of sinking between 800 - 900 mA for short
periods of time (125µs).
POWER SUPPLY SEQUENCING
The power supplies should be controlled to prevent large
currents during supply turn-on and turn-off. The recom-
mended sequence is +V followed by V
1
, always ensuring that
+V is the most positive supply. The -V supply is not critical
and can be asserted at any time.
+5V
+15V
V
REF
DATA (A)
V1
SYNC
CLOCK
A
OUT
+V
INPUTS
DATA (B)
CA
CB
STROBE
GND
-V
TO ARINC BUS
B
OUT
-15V
Figure 1.
ARINC 429 BUS APPLICATION
A
OUT
DATA (A)
LEVEL SHIFTER
AND SLOPE
CONTROL (A)
CLOCK
R
OUT
/ 2
OUTPUT
DRIVER (A)
R
L
SYNC
LEVEL SHIFTER
AND SLOPE
CONTROL (B)
C
L
F
A
R
OUT
/ 2
OUTPUT
DRIVER (B)
F
B
DATA (B)
V
1
STROBE
CURRENT
REGULATOR
Not included on HI-8383
OVER VOLTAGE
CLAMPS
GND
-V
C
B
B
OUT
Figure 2.
FUNCTIONAL BLOCK DIAGRAM
HOLT INTEGRATED CIRCUITS
2
HI-8382, HI-8383
PIN DESCRIPTIONS
SYMBOL
V
REF
STROBE
SYNC
DATA (A)
C
A
A
OUT
-V
GND
+V
B
OUT
C
B
DATA (B)
CLOCK
V
1
FUNCTION
POWER
INPUT
INPUT
INPUT
INPUT
OUTPUT
POWER
POWER
POWER
OUTPUT
INPUT
INPUT
INPUT
POWER
DESCRIPTION
THE REFERENCE VOLTAGE USED TO DETERMINE THE OUTPUT VOLTAGE SWING
A LOGIC HIGH ON THIS INPUT PLACES THE DRIVER IN POWER DOWN MODE
SYNCHRONIZES DATA INPUTS
DATA INPUT TERMINAL A
CONNECTION FOR DATA (A) SLEW-RATE CAPACITOR
ARINC OUTPUT TERMINAL A
-12V to -15V
0.0V
+12V to +15V
ARINC OUTPUT TERMINAL B
CONNECTION FOR DATA (B) SLEW-RATE CAPACITOR
DATA INPUT TERMINAL B
SYNCHRONIZES DATA INPUTS
+5V ±5%
ABSOLUTE MAXIMUM RATINGS
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage
Supply Voltage
SYMBOL
V
DIF
+V
-V
V
1
V
REF
V
IN
CONDITIONS
Voltage between +V and -V terminals
OPERATING RANGE
MAXIMUM
40
UNIT
V
V
V
V
V
V
V
V
+10.8 to +16.5
-10.8 to -16.5
+5 ±5%
For ARINC 429
For Applications other than ARINC
+5 ±5%
0 to 6
+7
6
6
> GND -0.3
< V1 +0.3
Voltage Reference
Input Voltage Range
Output Short-Circuit Duration
Output Overvoltage Protection
Operating Temperature Range
Storage Temperature Range
Lead Temperature
Junction Temperature
Power Dissipation
See Note: 1
See Note: 2
T
A
T
STG
Extended
Industrial
Ceramic & Plastic
Soldering, 10 seconds
T
J
P
D
16-Pin Ceramic DIP
28-Pin Ceramic LCC
28-Pin Plastic PLCC
32-Pin CERQUAD
16-Pin Ceramic DIP
28-Pin Ceramic LCC
28-Pin Plastic PLCC
32-Pin CERQUAD
See Note:
See Note:
See Note:
See Note:
3
3
3
3
-55 to +125
-40 to +85
-65 to +150
+275
+175
1.725
1.120
2.143
1.725
86.5
133.7
70.0
86.5
°C
°C
°C
°C
°C
W
W
W
W
°C/W
°C/W
°C/W
°C/W
Thermal Resistance,
(Junction-to-Ambient)
Ø
JA
Note 1. Heatsinking may be required for Output Short Circuit at +125°C and for 100KBPS at +125°C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater
than ±12.0V with respect to GND. (HI-8382 only)
Note 3. Derate above +25°C, 11.5mW/°C for 16-PIN DIP and 32-PIN CERQUAD, 7.5 mW/°C for 28-PIN LCC, 14.2 mW/°C for 28-PIN PLCC
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
3
HI-8382, HI-8383
DC ELECTRICAL CHARACTERISTICS
+V = +15V, -V = -15V, V
1
= V
REF
= +5.0V, T
A
= Operating Temperature Range (unless otherwise specified).
PARAMETER
Supply Current +V (Operating)
Supply Current -V (Operating)
Supply Current
V
1
(Operating)
Supply Current
V
REF
(Operating)
Supply Current +V (Power Down)
Supply Current -V (Power Down)
Supply Current +V (During Short Circuit Test)
Supply Current -V (During Short Circuit Test)
Output Short Circuit Current (Output High)
Output Short Circuit Current (Output Low)
Input Current (Input High)
Input Current (Input Low)
Input Voltage High
Input Voltage Low
Output Voltage High (Output to Ground)
Output Voltage Low (Output to Ground)
Output Voltage Null
Input Capacitance
SYMBOL
I
CCOP
(+V)
I
CCOP
(-V)
I
CCOP
(
V
1
)
I
CCOP
(
V
REF
)
I
CCPD
(+V)
I
CCPD
(-V)
I
SC
(+V)
I
SC
(-V)
I
OHSC
I
OLSC
I
IH
I
IL
V
IH
V
IL
V
OH
V
OL
V
NULL
C
IN
No Load
No Load
No Load
No Load
CONDITION
(0 - 100KBPS)
(0 - 100KBPS)
(0 - 100KBPS)
(0 - 100KBPS)
MIN
-11
TYP
MAX UNITS
+11
500
500
475
mA
mA
µA
µA
uA
uA
150
mA
mA
-80
mA
mA
1.0
-1.0
µA
µA
V
0.5
V
V
V
mV
pF
+V
REF
+.
25
-V
REF
+.
25
+250
STROBE = HIGH
STROBE = HIGH
Short to Ground
Short to Ground
Short to Ground
Short to Ground
(See Note: 1)
(See Note: 1)
-150
+80
-475
V
MIN
=0 (See Note: 2)
V
MIN
=0 (See Note: 2)
2.0
No Load
No Load
No Load
See Note 1
(0 -100KBPS)
(0 -100KBPS)
(0-100KBPS)
+V
REF
-.
25
-V
REF
-.
25
-250
15
Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter.
Note 2. Interchangeability of force and sense is acceptable.
AC ELECTRICAL CHARACTERISTICS
+V = +15V, -V = -15V, V
1
= V
REF
= +5.0V, T
A
= Operating Temperature Range (unless otherwise specified).
PARAMETER
Rise Time (
A
OUT
,
B
OUT
)
Fall Time (
A
OUT
,
B
OUT
)
Propagtion Delay Input to Output
Propagtion Delay Input to Output
SYMBOL
t
R
t
F
t
PLH
t
PHL
CONDITION
C
A
=
C
B
= 75pF
C
A
=
C
B
= 75pF
C
A
=
C
B
= 75pF
C
A
=
C
B
= 75pF
See Figure 3.
See Figure 3.
See Figure 3.
See Figure 3.
MIN
1.0
1.0
TYP
MAX UNITS
2.0
2.0
3.0
3.0
µs
µs
µs
µs
DATA (A) 0V
DATA (B) 0V
V
REF
50%
50%
ADJUST
BY
C
A
2.0V
0.5V
2.0V
0.5V
+4.75V to +5.25V
A
OUT
0V
ADJUST
BY
C
A
-V
REF
50%
50%
-4.75V to -5.25V
ADJUST
BY
C
B
ADJUST
BY
C
B
t
PHL
+V
REF
+4.75V to +5.25V
-4.75V to -5.25V
HIGH
NULL
B
OUT
0V
-V
REF
t
PLH
t
R
DIFFERENTIAL
OUTPUT 0V
2V
REF
+9.5V to +10.5V
(
A
OUT -
B
OUT
)
NOTE: OUTPUTS UNLOADED
t
F
-2V
RE
LOW
-9.5V to -10.5V
Figure 3.
SWITCHING WAVEFORMS
HOLT INTEGRATED CIRCUITS
4
HI-8382, HI-8383
HI-8382 PACKAGE THERMAL CHARACTERISTICS
MAXIMUM ARINC LOAD
PA C K A G E S T Y L E
28 Lead PLCC
16 Lead Ceramic SB DIP
1
7
2
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed
High Speed
3
4
S U P P LY C U R R E N T ( m A )
Ta = 25°C
Ta = 85°C
J U N C T I O N T E M P, T j ( ° C )
Ta = 25°C
Ta = 85°C
Ta = 125°C
Ta = 125°C
17.6
25.4
17.9
25.8
17.2
24.5
17.4
24.8
17.0
24.2
17.1
24.4
5, 6, 7
2
48
56
41
47
107
11 0
103
11 2
142
150
145
147
A
OUT
and B
OUT
Shorted To Ground
PA C K A G E S T Y L E
28 Lead PLCC
16 Lead Ceramic SB DIP
1
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed
High Speed
3
4
S U P P LY C U R R E N T ( m A )
Ta = 25°C
Ta = 85°C
J U N C T I O N T E M P, T j ( ° C )
Ta = 25°C
Ta = 85°C
Ta = 125°C
Ta = 125°C
60.1
63.1
62.1
64.0
55.7
56.3
56.2
56.2
52.4
52.3
53.0
52.2
11 0
100
90
86
157
150
145
144
194
182
180
176
Notes:
1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. Similar results would be obtained with AOUT shorted to BOUT.
6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
7. Data will vary depending on air flow and the method of heat sinking employed.
ORDERING INFORMATION
HI - 838x x x - xx (Ceramic)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
NOTES
Blank
T
M-01
M-03
PART
NUMBER
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
PACKAGE
DESCRIPTION
I
T
M
DSCC
No
No
Yes
Yes
(1)
(1) & (2)
LEAD
FINISH
NOTES
C
S
U
PART
NUMBER
8382
8383
16 PIN CERAMIC SIDE BRAZED DIP (16C)
28 PIN CERAMIC LEADLESS CHIP CARRIER (28S)
32 PIN CERQUAD (32U) not available with ‘M’ flow
OUTPUT SERIES
RESISTANCE
FUSE
Gold
Gold
Tin/Lead Solder
(3) & (1)
(3) & (1)
37.5 Ohms
13 Ohms
Yes
No
(1) Process Flows M and DSCC always have Tin/Lead (Sn/Pb) solder lead finish.
(2) DSCC SMD# 5962-8687901EA. Only available in “C” package with Sn/Pb solder lead finish.
(3) Gold terminal finish is Pb-Free, RoHS compliant.
HOLT INTEGRATED CIRCUITS
5
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HI-8383C-M-01 Related Products

HI-8383C-M-01 HI-8383C-M-03 HI-8383C-T HI-8383S-M-01 HI-8383S-T HI-8383U-T HI-8383JF HI-8382S-M-01
Description Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 LINE DRIVER, CDIP16, ROHS COMPLIANT, SIDE BRAZED, CERAMIC, DIP-16 Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, ROHS COMPLIANT, SIDE BRAZED, CERAMIC, DIP-16 Line Driver, 1 Func, 1 Driver, CMOS, CQCC28, CERAMIC, LCC-28 Line Driver, 1 Func, 1 Driver, CMOS, CQCC28, ROHS COMPLIANT, CERAMIC, LCC-28 Line Driver, 1 Func, 1 Driver, CMOS, CQCC32, CERQUAD-32 Line Driver, 1 Func, 1 Driver, CMOS, PQCC28, ROHS COMPLIANT, PLASTIC, LCC-28 Line Driver, 1 Func, 1 Driver, CMOS, CQCC28, CERAMIC, LCC-28
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Contains lead Lead free Lead free
Is it Rohs certified? incompatible conform to conform to incompatible conform to incompatible conform to incompatible
Maker Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits Holt Integrated Circuits
Parts packaging code DIP DIP DIP QLCC QLCC QFN QLCC QLCC
package instruction DIP, DIP16,.3 DIP, DIP, DIP16,.3 QCCN, LCC28,.45SQ QCCN, LCC28,.45SQ QCCJ, LDCC32,.5X.6,30 QCCJ, LDCC28,.5SQ QCCN, LCC28,.45SQ
Contacts 16 16 16 28 28 32 28 28
Reach Compliance Code unknown compliant compliant unknown compliant unknown compliant unknown
Differential output YES YES YES YES YES YES YES YES
Number of drives 1 1 1 1 1 1 1 1
Input properties DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL
Interface integrated circuit type LINE DRIVER LINE DRIVER LINE DRIVER LINE DRIVER LINE DRIVER LINE DRIVER LINE DRIVER LINE DRIVER
Interface standards ARINC 429 ARINC 429 ARINC 429 ARINC 429 ARINC 429 ARINC 429 ARINC 429 ARINC 429
JESD-30 code R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 S-CQCC-N28 S-CQCC-N28 R-CQCC-J32 S-PQCC-J28 S-CQCC-N28
JESD-609 code e0 e4 e4 e0 e4 e0 e3 e0
length 20.57 mm 20.57 mm 20.57 mm 11.4554 mm 11.4554 mm 13.97 mm 11.5062 mm 11.4554 mm
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 16 16 16 28 28 32 28 28
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -40 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP QCCN QCCN QCCJ QCCJ QCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE SQUARE
Package form IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 250 250 225 245 250
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.08 mm 2.54 mm 2.54 mm 4.826 mm 4.597 mm 2.54 mm
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Supply voltage 1-max 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V
Mains voltage 1-minute 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V
surface mount NO NO NO YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) GOLD Gold (Au) Tin/Lead (Sn/Pb) Gold (Au) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD J BEND J BEND NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 40 40 30 40 40
maximum transmission delay 3000 ns 3000 ns 3000 ns 3000 ns 3000 ns 3000 ns 3000 ns 3000 ns
width 7.62 mm 7.62 mm 7.62 mm 11.4554 mm 11.4554 mm 11.43 mm 11.5062 mm 11.4554 mm
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 7A994 EAR99
High level input current maximum value 0.000001 A - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Minimum output swing 9.5 V - 9.5 V 9.5 V 9.5 V 9.5 V 9.5 V 9.5 V
Encapsulate equivalent code DIP16,.3 - DIP16,.3 LCC28,.45SQ LCC28,.45SQ LDCC32,.5X.6,30 LDCC28,.5SQ LCC28,.45SQ
power supply 5,+-12/+-15 V - 5,+-12/+-15 V 5,+-12/+-15 V 5,+-12/+-15 V 5,+-12/+-15 V 5,+-12/+-15 V 5,+-12/+-15 V

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