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FW80960RP-33

Description
32-BIT, 33MHz, MICROPROCESSOR, PBGA352, PLASTIC, BGA-352
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size259KB,19 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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FW80960RP-33 Overview

32-BIT, 33MHz, MICROPROCESSOR, PBGA352, PLASTIC, BGA-352

FW80960RP-33 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeBGA
package instructionBGA, BGA352,26X26,50
Contacts352
Reach Compliance Codecompliant
Other featuresPCI TO PCI BRIDGE UNIT
Address bus width32
bit size32
boundary scanYES
External data bus width32
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeS-PBGA-B352
JESD-609 codee0
length35 mm
low power modeYES
Number of DMA channels3
Number of external interrupt devices9
Number of serial I/Os1
Number of terminals352
On-chip data RAM width8
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA352,26X26,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (number of words)1000
Maximum seat height2.52 mm
speed33 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width35 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

FW80960RP-33 Related Products

FW80960RP-33 FW80960RP33
Description 32-BIT, 33MHz, MICROPROCESSOR, PBGA352, PLASTIC, BGA-352 RISC Microprocessor, 32-Bit, 33.33MHz, MOS, PBGA352, BGA-352
Is it Rohs certified? incompatible incompatible
Maker Intel Intel
Parts packaging code BGA BGA
package instruction BGA, BGA352,26X26,50 BGA-352
Contacts 352 352
Reach Compliance Code compliant compliant
Address bus width 32 32
bit size 32 32
boundary scan YES YES
External data bus width 32 32
Format FIXED POINT FIXED POINT
Integrated cache NO NO
JESD-30 code S-PBGA-B352 S-PBGA-B352
JESD-609 code e0 e0
length 35 mm 35 mm
low power mode YES YES
Number of DMA channels 3 3
Number of external interrupt devices 9 9
Number of serial I/Os 1 1
Number of terminals 352 352
On-chip data RAM width 8 8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA352,26X26,50 BGA352,26X26,50
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
RAM (number of words) 1000 512
Maximum seat height 2.52 mm 2.52 mm
speed 33 MHz 33.33 MHz
Maximum supply voltage 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology MOS MOS
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 35 mm 35 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR, RISC
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