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BUS-65112-300

Description
Mil-Std-1553 Controller, 2 Channel(s), CMOS, CQIP78, 1.900 X 2.100 INCH, HERMETIC SEALED, DDIP-78
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size127KB,3 Pages
ManufacturerData Device Corporation
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BUS-65112-300 Overview

Mil-Std-1553 Controller, 2 Channel(s), CMOS, CQIP78, 1.900 X 2.100 INCH, HERMETIC SEALED, DDIP-78

BUS-65112-300 Parametric

Parameter NameAttribute value
MakerData Device Corporation
Parts packaging codeQIP
package instruction1.900 X 2.100 INCH, HERMETIC SEALED, DDIP-78
Contacts78
Reach Compliance Codeunknown
Address bus width12
boundary scanNO
letter of agreementMIL-STD-1553
Data encoding/decoding methodsNRZ
External data bus width16
JESD-30 codeR-CQIP-P78
low power modeNO
Number of serial I/Os2
Number of terminals78
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height6.35 mm
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationQUAD
width41.91 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

BUS-65112-300 Related Products

BUS-65112-300 BUS-65117-300
Description Mil-Std-1553 Controller, 2 Channel(s), CMOS, CQIP78, 1.900 X 2.100 INCH, HERMETIC SEALED, DDIP-78 Mil-Std-1553 Controller, 2 Channel(s), CMOS, CDFP82, HERMETIC SEALED, FP-82
Maker Data Device Corporation Data Device Corporation
Parts packaging code QIP DFP
package instruction 1.900 X 2.100 INCH, HERMETIC SEALED, DDIP-78 DFP,
Contacts 78 82
Reach Compliance Code unknown unknown
Address bus width 12 12
boundary scan NO NO
letter of agreement MIL-STD-1553 MIL-STD-1553
Data encoding/decoding methods NRZ NRZ
External data bus width 16 16
JESD-30 code R-CQIP-P78 R-CDFP-F82
low power mode NO NO
Number of serial I/Os 2 2
Number of terminals 78 82
Maximum operating temperature 70 °C 70 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QIP DFP
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK
Certification status Not Qualified Not Qualified
Maximum seat height 6.35 mm 4.6 mm
Nominal supply voltage 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form PIN/PEG FLAT
Terminal pitch 2.54 mm 1.27 mm
Terminal location QUAD DUAL
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
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