LX5543
TM
®
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier and SP3T Switch
P
RODUCTION
D
ATA
S
HEET
KEY FEATURES
DESCRIPTION
LX5543 is a WLAN front-end
module (FEM) for 802.11b/g/n and
other applications in the 2.4-2.5GHz
frequency range. LX5543 integrates
an advanced InGaP/GaAs Hetero-
junction Bipolar Transistor (HBT)
power amplifier with on chip
impedance matching and a Depletion
mode pHEMT (D-pHEMT) single-
pole triple-throw (SP3T) switch in a
single package with 3x3mm footprint.
LX5543 provides capability of sharing
a single antenna between WLAN and
Bluetooth systems through the SP3T
switch.
The Tx path of LX5543 features a
two-stage monolithic microwave
integrated circuit (MMIC) power
amplifier with active bias circuitry,
on-chip output power detector, and
50 input/output matching inside the
package. With 3.6V supply voltage
and 82mA bias current, the Tx path
provides about 25dB power gain, and
+17dBm linear output power, with
EVM (<3%) for 64QAM/ 54Mbps
OFDM. Both gain and power are
readily measured at antenna port, with
the insertion loss of the SP3T switch
included.
The Rx path of LX5543 features low
insertion loss of 0.6dB and high input
referred 1dB gain compression point
(IP
1dB
) of +25dBm. Bluetooth path of
LX5543 features insertion loss 0.9dB,
and IP
1dB
of +29dBm.
LX5543 is available in a 16-pin, low
profile of 0.55mm, 3x3mm
2
micro-
lead package (MLPQ-16L). With its
high level of functional integration,
best-class
performance,
compact
footprint and low profile, LX5543
offers an ideal front-end solution for
the ever demanding design require-
ments of today’s highly integrated
mobile equipments, including 802.11
b/g/n and Bluetooth applications.
2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
SP3T for Sharing Antenna
between WLAN and Bluetooth
systems
All RF I/O Matched to 50
Single-Supply Voltage 3.0V to
4.2V
2
Small Footprint: 3x3mm
Low Profile: 0.55mm
RoHS Compliant & Pb-Free
TX Features :
Power Gain ~ 25dB*
Pout ~ +17dBm* for 3% EVM
at Antenna
Current ~145mA at +17dBm*
Pout ~ +21dBm* for 11b 1Mbps
DSSS Mask Compliance
Quiescent Current ~ 82mA
RX Features :
Insertion Loss ~ 0.6 dB
IP
1dB
~ +25 dBm
Bluetooth Path :
Insertion Loss ~ 0.9 dB
IP
1dB
~ +29 dBm
* Including SP3T switch loss
APPLICATIONS
W W W.
Microsemi
.CO
M
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
IEEE 802.11b/g/n
Mobile Phone WLAN module
BLOCK DIAGRAM
Vref Vc1
PAOut/
SwIn
Vc2
TxIn
Det
RxOut
IMN*
PA
OMN*
LX5543
LX5543
Antenna
Port
BT
*IMN:
Input Matching Network
*OMN:
Output Matching Network
CtrlTx / CtrlRx / CtrlBT
Copyright
2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX5543
TM
®
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier and SP3T Switch
P
RODUCTION
D
ATA
S
HEET
PRODUCT HIGHLIGHT
W W W.
Microsemi
.CO
M
MSC
5543
5552
818A
933A
PACKAGE ORDER INFO
LU
Plastic MLPQ
16 pin 3x3mm
RoHS Compliant /Pb-Free
LX5543LU
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5543LU-TR)
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
TxIn NC Vc1 Vc2
DC Supply Voltage, RF off ...............................................................................5V
Collector Current (PA)................................................................................500mA
Total Power Dissipation....................................................................................2W
RF Input Power (TxIn)..............................................................................+10dBm
RF Input Power (Ant, SwIn, BT)..............................................................+25dBm
Maximum Junction Temperature (Tj max) ................................................ +150°C
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature ....................................................................-65°C to +150°C
RoHS/Pb-Free Peak Package Temp. for Solder Reflow
(40 seconds maximum exposure)................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
16
Vcc
Vref
Det
RxOut
1
2
3
4
5
15
14
13
12
11
10
PAOut
SwIn
CtrlRx
CtrlTx
GND
6
7
8
9
NC BT CtrlBT Ant
LU P
ACKAGE
(“See-Through” View from Top)
RoHS/Pb-free 100% Matte Tin Lead finish
THERMAL DATA
LU
Plastic MLPQ 16-Pin
A
MBIENT
,
JA
10 C/W
50 C/W
P
ACKAGE
D
ATA
P
ACKAGE
D
ATA
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
JC
THERMAL RESISTANCE
-
JUNCTION TO
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
JA
).
The
JA
numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
Copyright
2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
LX5543
TM
®
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier and SP3T Switch
P
RODUCTION
D
ATA
S
HEET
Thank you for your interest in Microsemi
®
Analog Mixed Signal products.
The full data sheet for this device contains proprietary information.
To obtain a copy, please contact your local Microsemi sales representative. The
name of your local representative can be obtained at the following link
http://www.microsemi.com/contact/contactfind.asp
or
Contact us directly by sending an email to:
IPGdatasheets@microsemi.com
Be sure to specify the data sheet you are requesting and include your company
name and contact information and or vcard.
We look forward to hearing from you.
W W W.
Microsemi
.CO
M
Copyright
2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
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