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TMS27C256-15JL

Description
UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
Categorystorage    storage   
File Size207KB,13 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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TMS27C256-15JL Overview

UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28

TMS27C256-15JL Parametric

Parameter NameAttribute value
MakerRochester Electronics
package instructionDIP,
Reach Compliance Codeunknown
Maximum access time150 ns
JESD-30 codeR-GDIP-T28
length36.83 mm
memory density262144 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Maximum seat height4.91 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
TMS27C256 32768 BY 8 BIT UV ERASABLE
TMS27PC256 32768 BY 8 BIT
PROGRAMMABLE READ ONLY MEMORIES
SMLS256H− SEPTEMBER 1984 − REVISED NOVEMBER 1997
D
Organization . . . 32 768 by 8 Bits
D
Single 5-V Power Supply
D
Pin Compatible With Existing 256K MOS
D
D
ROMs, PROMs, and EPROMs
All Inputs / Outputs Fully TTL Compatible
Max Access / Min Cycle Time
V
CC
±
10%
’27C/ PC256-10
100 ns
’27C/ PC256-12
120 ns
’27C/ PC256-15
150 ns
’27C/ PC256-17
170 ns
’27C/ PC256-20
200 ns
’27C/ PC256-25
250 ns
Power Saving CMOS Technology
Very High-Speed SNAP! Pulse
Programming
3-State Output Buffers
400-mV Minimum DC Noise Immunity With
Standard TTL Loads
Latchup Immunity of 250 mA on All Input
and Output Lines
Low Power Dissipation ( V
CC
= 5.5 V )
− Active . . . 165 mW Worst Case
− Standby . . . 1.4 mW Worst Case
(CMOS Input Levels)
Temperature Range Options
256K EPROM Available With MIL-STD-883C
Class B High Reliability Processing
(SMJ27C256)
J PACKAGE
( TOP VIEW )
D
D
D
D
D
D
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
FM PACKAGE
( TOP VIEW )
A7
A12
VPP
NU
VCC
A14
A13
4
3 2 1 32 31 30
29
28
27
26
25
24
23
22
21
14 15 16 17 18 19 20
D
D
description
The TMS27C256 series are 32 768 by 8-bit
(262 144-bit), ultraviolet (UV) light erasable,
electrically programmable read-only memories
(EPROMs).
The TMS27PC256 series are 32 768 by 8-bit
(262 144-bit), one-time programmmable (OTP)
electrically programmable read-only memories
(PROMs).
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
5
6
7
8
9
10
11
12
13
A8
A9
A11
NC
G
A10
E
DQ7
DQ6
PIN NOMENCLATURE
A0 −A14
DQ0 −DQ7
E
G
GND
NC
NU
VCC
VPP
Address Inputs
Inputs (programming) / Outputs
Chip Enable / Powerdown
Output Enable
Ground
No Internal Connection
Make No External Connection
5-V Power Supply
13-V Power Supply †
† Only in program mode
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
DQ1
DQ2
GND
NU
DQ3
DQ4
DQ5
Copyright
1997, Texas Instruments Incorporated
1

TMS27C256-15JL Related Products

TMS27C256-15JL TMS27C256-17JE TMS27C256-17JL TMS27C256-20JE TMS27C256-20JL TMS27C256-25JL TMS27C256-10JL
Description UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 250ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 UVPROM, 32KX8, 100ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
package instruction DIP, DIP, DIP, DIP, DIP, DIP, DIP,
Reach Compliance Code unknown unknow unknow unknow unknow unknow unknow
Maximum access time 150 ns 170 ns 170 ns 200 ns 200 ns 250 ns 100 ns
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28
length 36.83 mm 36.83 mm 36.83 mm 36.83 mm 36.83 mm 36.83 mm 36.83 mm
memory density 262144 bit 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Maximum seat height 4.91 mm 4.91 mm 4.91 mm 4.91 mm 4.91 mm 4.91 mm 4.91 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
Base Number Matches - 1 1 1 1 1 1

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