Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS
| Parameter Name | Attribute value |
| Maker | Harris |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| Other features | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR |
| series | 4000/14000/40000 |
| JESD-30 code | X-XUUC-N14 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUFFER |
| Number of functions | 6 |
| Number of entries | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 175.5 ns |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| CD4010BHMSR | 5962R9582901VEC | 5962R9582901VXC | CD4010BFMSR | CD4010BDMSR | CD4010BKMSR | |
|---|---|---|---|---|---|---|
| Description | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16 |
| package instruction | DIE, | , | , | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Other features | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR |
| series | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 code | X-XUUC-N14 | R-GDIP-T16 | R-CDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | R-CDFP-F16 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| Number of functions | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of entries | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| propagation delay (tpd) | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal location | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL |
| encapsulated code | DIE | - | - | DIP | DIP | DFP |
| JESD-609 code | - | e4 | e4 | e0 | e0 | e0 |
| Terminal surface | - | GOLD | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| total dose | - | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
京公网安备 11010802033920号
EEWORLD
