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SMUN5313DW

Description
NPN / PNP Digital Small Signal Transistor
File Size354KB,29 Pages
ManufacturerSECOS
Websitehttp://www.secosgmbh.com/
Download Datasheet View All

SMUN5313DW Overview

NPN / PNP Digital Small Signal Transistor

SMUN5311DW Series
Elektronische Bauelemente
NPN / PNP
Digital Small Signal Transistors
RoHS Compliant Product
A suffix of “-C” indicates halogen-free.
DESCRIPTION
The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a base−emitter
resistor. These digital transistors are designed to replace a single device and its
external resistor bias network. The BRT eliminates these individual components by
integrating them into a single device. In the SMUN5311DW series, two
complementary BRT devices are housed in the SOT−363 package which is ideal
for low power surface mount applications where board space is at a premium.
SOT-363
A
E
L
B
FEATURE
Simplifies circuit design
Reduces board space
Reduces component count
Available in 8 mm, 7 inch/3000 unit tape and reel
The devices are Pb-Free
6
5
4
F
DG
K
C
H
J
REF.
A
B
C
D
E
F
Q
2
R
2
R
1
1
2
R
1
R
2
Q
1
3
Millimeter
Min.
Max.
2.00
2.20
2.15
2.45
1.15
1.35
0.90
1.10
1.20
1.40
0.15
0.35
REF.
G
H
J
K
L
Millimeter
Min.
Max.
0.100 REF.
0.525 REF.
0.08
0.15
0.650 TYP.
MAXIMUM RATINGS AND THERMAL CHARACTERISTICS
(T
A
= 25° unless otherwise noted, common for Q1 and Q 2, minus sign for Q1(PNP) omitted)
C
PARAMETER
Collector - Base Voltage
Collector - Emitter Voltage
Collector Currrent – Continuous
SYMBOL
V
CBO
V
CEO
I
C
VALUE
50
50
100
187(1)
256(2)
1.5(1)
2.0(2)
670(1)
490(2)
250(1)
385(2)
2.0(1)
3.0(2)
493(1)
325(2)
188(1)
208(2)
-55~150
UNIT
Vdc
Vdc
mAdc
ONE JUNCTION HEATED THERMAL CHARACTERISTICS
Total Device Dissipation, T
A
=25°
C
P
D
Total Device Dissipation, Derate above 25°
C
Thermal Resistance, Junction to Ambient
R
θJA
mW
mW/°
C
°
C/W
BOTH JUNCTION HEATED THERMAL CHARACTERISTICS
Total Device Dissipation, T
A
=25°
C
P
D
Total Device Dissipation, Derate above 25°
C
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Junction Temperature & Storage Temperature
Note:
1. FR-4 @ minimum pad
2. FR-4 @ 1.0 x 1.0 inch pad
R
θJA
R
θJL
T
J
,T
STG
mW
mW/°
C
°
C/W
°
C/W
°
C
18-Dec-2009 Rev. A
Page 1 of 28

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