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74HCT40105DB,112

Description
16 X 4 OTHER FIFO, 120 ns, PDIP16
Categorystorage    storage   
File Size179KB,25 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT40105DB,112 Overview

16 X 4 OTHER FIFO, 120 ns, PDIP16

74HCT40105DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
package instructionSSOP, SSOP16,.3
Contacts16
Manufacturer packaging codeSOT338-1
Reach Compliance Codecompli
Maximum access time120 ns
Maximum clock frequency (fCLK)31 MHz
period time100 ns
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length6.2 mm
memory density64 bi
Memory IC TypeOTHER FIFO
memory width4
Humidity sensitivity level1
Number of functions1
Number of terminals16
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize16X4
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
74HC/HCT40105
4-bit x 16-word FIFO register
Product specification
Supersedes data of December 1990
File under Integrated Circuits, IC06
1998 Jan 23

74HCT40105DB,112 Related Products

74HCT40105DB,112 74HC40105D,653 74HCT40105DB,118 74HC40105DB,112 74HC40105DB,118
Description 16 X 4 OTHER FIFO, 120 ns, PDIP16 16 X 4 OTHER FIFO, 120 ns, PDIP16 16 X 4 OTHER FIFO, 120 ns, PDIP16 16 X 4 OTHER FIFO, 120 ns, PDIP16 16 X 4 OTHER FIFO, 120 ns, PDIP16
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP
Parts packaging code SSOP1 SOP SSOP1 SSOP1 SSOP1
package instruction SSOP, SSOP16,.3 3.90 MM, PLASITC, MS-012AC, SOT-109-1, SO-16 SSOP, SSOP, SSOP16,.3 SSOP,
Contacts 16 16 16 16 16
Manufacturer packaging code SOT338-1 SOT109-1 SOT338-1 SOT338-1 SOT338-1
Reach Compliance Code compli compli compli compli compli
Maximum access time 120 ns 600 ns 120 ns 600 ns 600 ns
period time 100 ns 71.428 ns 100 ns 71.428 ns 71.428 ns
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
length 6.2 mm 9.9 mm 6.2 mm 6.2 mm 6.2 mm
memory density 64 bi 64 bi 64 bi 64 bi 64 bi
memory width 4 4 4 4 4
Humidity sensitivity level 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 16 16 16 16 16
word count 16 words 16 words 16 words 16 words 16 words
character code 16 16 16 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 16X4 16X4 16X4 16X4 16X4
Exportable YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SOP SSOP SSOP SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 1.75 mm 2 mm 2 mm 2 mm
Maximum supply voltage (Vsup) 5.5 V 6 V 5.5 V 6 V 6 V
Minimum supply voltage (Vsup) 4.5 V 2 V 4.5 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 4.5 V 5 V 4.5 V 4.5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30
width 5.3 mm 3.9 mm 5.3 mm 5.3 mm 5.3 mm
Maximum clock frequency (fCLK) 31 MHz 14 MHz - 33 MHz -
JESD-609 code e4 - e4 e4 e4
Memory IC Type OTHER FIFO OTHER FIFO - OTHER FIFO -
Encapsulate equivalent code SSOP16,.3 SOP16,.25 - SSOP16,.3 -
power supply 5 V 2/6 V - 2/6 V -
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