PGM & PPS Series
Pin Grid Array Sockets
PGM168-7A1715-V
PPS238-7A1916-V
FEATURES:
• LIF & SUPERLIF Low insertion and withdrawal force contacts
™
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition V, D, 11.6 G’s (RMS)
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016, 50 cycles
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. Above 150 pins - 37 Grams (1.3 oz.) average with
SUPERLIF
™
a .018" (0,46) dia. polished steel pin
Insertion Force .............. Below 150 pins - 50 Grams (1.7 oz.) average with
LIF
a .018" (0,46) dia. polished steel pin
Withdrawal Force .......... Above 150 pins - 15 Grams (.52 oz.) average with
SUPERLIF
™
a .018" (0,46) dia. polished steel pin
Withdrawal Force .......... Below 150 pins - 20 Grams (.70 oz.) average with
LIF
a .018" (0,46) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002, Type II
Operation Temperature .. Gold inner contact -55°C to +125°C
Tin/lead inner contact -55°C to +105°C
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
D
• Non-wicking closed bottom, precision sleeve protects 100% against flux
and solder contamination
• Custom design capabilities
• Available in molded plastic (PGM) and glass epoxy (PPS) insulators
•
Recognized under the Component Program of Underwriters
®
Laboratories, Inc. File E111362
• High temperature insulators allow the sockets to be soldered with
vaporphase and infrared reflow soldering process
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester or glass epoxy,
UL rated 94V-0
Sleeve ............................ Machined brass/formed copper
Contact .......................... Beryllium copper
Sleeve Plating ................ See Table 1
Contact Plating .............. See Table 1
HOW TO ORDER
P
Number of
Contacts
GM
- Molded Thermoplastic Polyester
PS
- Glass Epoxy
SM
- Molded Standoffs (refer to fig. 1)
Pin
Grid size
Selection
(Table 2)
Plating
Options
(Table 1)
Footprint
Options
(Pg. D23)
V
Low Force, Six
Finger Contact
Part Number Example: PGM068-1A1132-V
Quality & Innovation From The
Product Group
D2
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
FPGA/CPLD
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EEWORLD
