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MBM29F040C-70PD-E1

Description
Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size302KB,41 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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MBM29F040C-70PD-E1 Overview

Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32

MBM29F040C-70PD-E1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeQFJ
package instructionPLASTIC, LCC-32
Contacts32
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-PQCC-J32
JESD-609 codee3
length13.97 mm
memory density4194304 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
typeNOR TYPE
width11.43 mm
Base Number Matches1
SPANSION Flash Memory
Data Sheet
TM
September 2003
TM
This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,
these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a SPANSION
revisions will occur when appropriate, and changes will be noted in a revision summary.
TM
product. Future routine
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about SPANSION
solutions.
TM
memory

MBM29F040C-70PD-E1 Related Products

MBM29F040C-70PD-E1 MBM29F040C-55PFTR-E1 MBM29F040C-55PFTN-E1 MBM29F040C-55PD-E1 MBM29F040C-70PFTN-E1 MBM29F040C-70PFTR-E1 MBM29F040C-90PFTR-E1 MBM29F040C-90PFTN-E1 MBM29F040C-90PD-E1
Description Flash, 512KX8, 70ns, PQCC32, PLASTIC, LCC-32 Flash, 512KX8, 55ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 Flash, 512KX8, 55ns, PDSO32, PLASTIC, TSOP1-32 Flash, 512KX8, 55ns, PQCC32, PLASTIC, LCC-32 Flash, 512KX8, 70ns, PDSO32, PLASTIC, TSOP1-32 Flash, 512KX8, 70ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 Flash, 512KX8, 90ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 Flash, 512KX8, 90ns, PDSO32, PLASTIC, TSOP1-32 Flash, 512KX8, 90ns, PQCC32, PLASTIC, LCC-32
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code QFJ TSOP1 TSOP1 QFJ TSOP1 TSOP1 TSOP1 TSOP1 QFJ
package instruction PLASTIC, LCC-32 PLASTIC, REVERSE, TSOP1-32 PLASTIC, TSOP1-32 PLASTIC, LCC-32 PLASTIC, TSOP1-32 PLASTIC, REVERSE, TSOP1-32 PLASTIC, REVERSE, TSOP1-32 PLASTIC, TSOP1-32 PLASTIC, LCC-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code compli compli compli compli compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 55 ns 55 ns 55 ns 70 ns 70 ns 90 ns 90 ns 90 ns
JESD-30 code R-PQCC-J32 R-PDSO-G32 R-PDSO-G32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PQCC-J32
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3
length 13.97 mm 18.4 mm 18.4 mm 13.97 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 13.97 mm
memory density 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ TSSOP TSSOP QCCJ TSSOP TSSOP TSSOP TSSOP QCCJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 1.2 mm 1.2 mm 3.56 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 3.56 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form J BEND GULL WING GULL WING J BEND GULL WING GULL WING GULL WING GULL WING J BEND
Terminal pitch 1.27 mm 0.5 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 1.27 mm
Terminal location QUAD DUAL DUAL QUAD DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature 40 40 40 40 40 40 40 40 40
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11.43 mm 8 mm 8 mm 11.43 mm 8 mm 8 mm 8 mm 8 mm 11.43 mm
Base Number Matches 1 1 1 1 1 1 1 1 1

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