74LVC08APW/G,118 datasheet, PDF

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74LVC08APW/G,118: DescriptionLVC/LCX/Z SERIES, QUAD 2-INPUT AND GATE, PDSO14; Categorylogic logic; File Size264KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74LVC08APW/G,118 Overview

LVC/LCX/Z SERIES, QUAD 2-INPUT AND GATE, PDSO14

74LVC08APW/G,118 Parametric

Parameter Name	Attribute value
Source Url Status Check Date	2013-06-14 00:00:00
Brand Name	NXP Semiconduc
Maker	NXP
package instruction	TSSOP,
Reach Compliance Code	unknow
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	5 mm
Logic integrated circuit type	AND GATE
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	9 ns
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.2 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	4.4 mm

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74LVC08A

Quad 2-input AND gate

Rev. 6 — 16 December 2011

Product data sheet

1. General description

The 74LVC08A provides four 2-input AND gates.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these

devices as translators in mixed 3.3 V and 5 V applications.

2. Features and benefits



5 V tolerant inputs for interfacing with 5 V logic

Wide supply voltage range from 1.2 V to 3.6 V

CMOS low power consumption

Direct interface with TTL levels

Complies with JEDEC standard:



JESD8-7A (1.65 V to 1.95 V)



JESD8-5A (2.3 V to 2.7 V)



JESD8-C/JESD36 (2.7 V to 3.6 V)



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-B exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74LVC08AD

74LVC08ADB

74LVC08APW

74LVC08ABQ

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

Name

SO14

SSOP14

TSSOP14

Description

plastic small outline package; 14 leads;

body width 3.9 mm

plastic shrink small outline package; 14 leads;

body width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT337-1

SOT402-1

SOT762-1

Type number

DHVQFN14 plastic dual in-line compatible thermal enhanced very

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

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Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Reach Compliance Code	unknow	compli	compli	compli	compli	compli	unknow	compli	compli
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4	e4
length	5 mm	6.2 mm	6.2 mm	3 mm	8.65 mm	8.65 mm	5 mm	5 mm	5 mm
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE	AND GATE
Number of functions	4	4	4	4	4	4	4	4	4
Number of entries	2	2	2	2	2	2	2	2	2
Number of terminals	14	14	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SSOP	SSOP	HVQCCN	SOP	SOP	TSSOP	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	9 ns	9 ns	9 ns	9 ns	9 ns	9 ns	9 ns	9 ns	9 ns
Maximum seat height	1.1 mm	2 mm	2 mm	1 mm	1.75 mm	1.75 mm	1.1 mm	1.1 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.5 mm	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL
width	4.4 mm	5.3 mm	5.3 mm	2.5 mm	3.9 mm	3.9 mm	4.4 mm	4.4 mm	4.4 mm
package instruction	TSSOP,	SSOP, SSOP14,.3	SSOP, SSOP14,.3	HVQCCN, LCC14,.1X.12,20	3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14	-	4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14	TSSOP, TSSOP14,.25	-
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	-	conform to	conform to
Parts packaging code	-	SSOP1	SSOP1	QFN	SOIC	SOIC	TSSOP	TSSOP	TSSOP
Contacts	-	14	14	14	14	14	14	14	14
Manufacturer packaging code	-	SOT337-1	SOT337-1	SOT762-1	SOT108-1	SOT108-1	SOT402-1	SOT402-1	SOT402-1
Is Samacsys	-	N	N	N	N	N	-	N	N
Load capacitance (CL)	-	50 pF	50 pF	50 pF	50 pF	50 pF	-	50 pF	50 pF
MaximumI(ol)	-	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	-	0.024 A	0.024 A
Humidity sensitivity level	-	1	1	1	1	1	-	1	1
Encapsulate equivalent code	-	SSOP14,.3	SSOP14,.3	LCC14,.1X.12,20	SOP14,.25	SOP14,.25	-	TSSOP14,.25	TSSOP14,.25
method of packing	-	BULK PACK	TAPE AND REEL	TAPE AND REEL	BULK PACK	TAPE AND REEL	-	BULK PACK	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260	-	260	260
power supply	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V
Prop。Delay @ Nom-Su	-	4.8 ns	4.8 ns	4.8 ns	4.8 ns	4.8 ns	-	4.8 ns	4.8 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Schmitt trigger	-	NO	NO	NO	NO	NO	-	NO	NO
Maximum time at peak reflow temperature	-	30	30	30	30	30	-	30	30
Base Number Matches	-	1	1	1	1	1	-	1	1

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