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W963L6ABN80I

Description
512K WORD X 16 BIT LOW POWER PSEUDO SRAM
Categorystorage    storage   
File Size415KB,30 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W963L6ABN80I Overview

512K WORD X 16 BIT LOW POWER PSEUDO SRAM

W963L6ABN80I Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeBGA
package instructionBGA, BGA48,6X8,30
Contacts48
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Maximum access time75 ns
Other featuresALSO OPERATES WITH 2.7V TO 3.3V SUPPLY
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
JESD-609 codee1
memory density8388608 bi
Memory IC TypePSEUDO STATIC RAM
memory width16
Number of functions1
Number of terminals48
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply2.5/3 V
Certification statusNot Qualified
Maximum standby current0.00007 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
W963L6ABN
512K WORD
×
16 BIT LOW POWER PSEUDO SRAM
Table of Contents-
1. GENERAL DESCRIPTION.................................................................................................................. 3
2. FEATURES ......................................................................................................................................... 3
3. PRODUCT OPTIONS ......................................................................................................................... 3
4. BALL CONFIGURATION .................................................................................................................... 4
5. BALL DESCRIPTION .......................................................................................................................... 4
6. BLOCK DIAGRAM .............................................................................................................................. 5
7. FUNCTION TRUTH TABLE ................................................................................................................ 6
8. ELECTRICAL CHARACTERISTICS ................................................................................................... 7
Absolute Maximum Ratings .............................................................................................................. 7
Recommended Operating Conditions............................................................................................... 7
Capacitance ...................................................................................................................................... 8
DC Characteristics ............................................................................................................................ 8
AC Characteristics ............................................................................................................................ 9
Read Operation ..........................................................................................................................................9
Write Operation.........................................................................................................................................11
P
ower
D
own
and P
ower
D
own
P
rogram
P
arameters ............................................................................13
Other Timing Parameters .........................................................................................................................13
AC Test Conditions...................................................................................................................................13
9. TIMING WAVEFORMS ..................................................................................................................... 14
Read Timing #1 (
OE
Control Access)........................................................................................... 14
Read Timing #2 (
CE1
Control Access) ......................................................................................... 15
Read Timing #3 (Address Access after
OE
Control Access)....................................................... 16
Read Timing #4 (Address Access after
CE1
Control Access) ..................................................... 17
Write Timing #1 (
CE1
Control) ...................................................................................................... 18
Write Timing #2-1 (
WE
Control, Single Write Operation) ............................................................. 19
Write Timing #2 (
WE
Control, Continuous Write Operation)......................................................... 20
Read/Write Timing #1-1 (
CE1
Control) .......................................................................................... 21
Read/Write Timing #1-2 (
CE1
Control) .......................................................................................... 22
Publication Release Date: March 11, 2003
Revision A1
-1-

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Description 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code BGA - BGA BGA BGA BGA BGA
package instruction BGA, BGA48,6X8,30 - BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30
Contacts 48 - 48 48 48 48 48
Reach Compliance Code compli - compli compli compli compli compli
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 75 ns - 75 ns 75 ns 65 ns 65 ns 65 ns
Other features ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY - ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY
I/O type COMMON - COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 - R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48
JESD-609 code e1 - e1 e1 e1 e1 e1
memory density 8388608 bi - 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type PSEUDO STATIC RAM - PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM
memory width 16 - 16 16 16 16 16
Number of functions 1 - 1 1 1 1 1
Number of terminals 48 - 48 48 48 48 48
word count 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 - 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 70 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -25 °C - -40 °C -25 °C -
organize 512KX16 - 512KX16 512KX16 512KX16 512KX16 512KX16
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA48,6X8,30 - BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3 V - 2.5/3 V 2.5/3 V 2.5/3 V 2.5/3 V 2.5/3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00007 A - 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A
Maximum slew rate 0.02 mA - 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V - 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES - YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - OTHER COMMERCIAL INDUSTRIAL OTHER COMMERCIAL
Terminal surface TIN SILVER COPPER - TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL - BALL BALL BALL BALL BALL
Terminal pitch 0.75 mm - 0.75 mm 0.75 mm 0.75 mm 0.75 mm 0.75 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM

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