EEWORLDEEWORLDEEWORLD

Part Number

Search

W963L6ABN70I

Description
512K WORD X 16 BIT LOW POWER PSEUDO SRAM
Categorystorage    storage   
File Size415KB,30 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W963L6ABN70I Overview

512K WORD X 16 BIT LOW POWER PSEUDO SRAM

W963L6ABN70I Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeBGA
package instructionBGA, BGA48,6X8,30
Contacts48
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Maximum access time65 ns
Other featuresALSO OPERATES WITH 2.7V TO 3.3V SUPPLY
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
JESD-609 codee1
memory density8388608 bi
Memory IC TypePSEUDO STATIC RAM
memory width16
Number of functions1
Number of terminals48
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply2.5/3 V
Certification statusNot Qualified
Maximum standby current0.00007 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Base Number Matches1
W963L6ABN
512K WORD
×
16 BIT LOW POWER PSEUDO SRAM
Table of Contents-
1. GENERAL DESCRIPTION.................................................................................................................. 3
2. FEATURES ......................................................................................................................................... 3
3. PRODUCT OPTIONS ......................................................................................................................... 3
4. BALL CONFIGURATION .................................................................................................................... 4
5. BALL DESCRIPTION .......................................................................................................................... 4
6. BLOCK DIAGRAM .............................................................................................................................. 5
7. FUNCTION TRUTH TABLE ................................................................................................................ 6
8. ELECTRICAL CHARACTERISTICS ................................................................................................... 7
Absolute Maximum Ratings .............................................................................................................. 7
Recommended Operating Conditions............................................................................................... 7
Capacitance ...................................................................................................................................... 8
DC Characteristics ............................................................................................................................ 8
AC Characteristics ............................................................................................................................ 9
Read Operation ..........................................................................................................................................9
Write Operation.........................................................................................................................................11
P
ower
D
own
and P
ower
D
own
P
rogram
P
arameters ............................................................................13
Other Timing Parameters .........................................................................................................................13
AC Test Conditions...................................................................................................................................13
9. TIMING WAVEFORMS ..................................................................................................................... 14
Read Timing #1 (
OE
Control Access)........................................................................................... 14
Read Timing #2 (
CE1
Control Access) ......................................................................................... 15
Read Timing #3 (Address Access after
OE
Control Access)....................................................... 16
Read Timing #4 (Address Access after
CE1
Control Access) ..................................................... 17
Write Timing #1 (
CE1
Control) ...................................................................................................... 18
Write Timing #2-1 (
WE
Control, Single Write Operation) ............................................................. 19
Write Timing #2 (
WE
Control, Continuous Write Operation)......................................................... 20
Read/Write Timing #1-1 (
CE1
Control) .......................................................................................... 21
Read/Write Timing #1-2 (
CE1
Control) .......................................................................................... 22
Publication Release Date: March 11, 2003
Revision A1
-1-

W963L6ABN70I Related Products

W963L6ABN70I W963L6ABN W963L6ABN80I W963L6ABN80E W963L6ABN80 W963L6ABN70E W963L6ABN70
Description 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM 512K WORD X 16 BIT LOW POWER PSEUDO SRAM
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code BGA - BGA BGA BGA BGA BGA
package instruction BGA, BGA48,6X8,30 - BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30 BGA, BGA48,6X8,30
Contacts 48 - 48 48 48 48 48
Reach Compliance Code compli - compli compli compli compli compli
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 65 ns - 75 ns 75 ns 75 ns 65 ns 65 ns
Other features ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY - ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY ALSO OPERATES WITH 2.7V TO 3.3V SUPPLY
I/O type COMMON - COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 - R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48
JESD-609 code e1 - e1 e1 e1 e1 e1
memory density 8388608 bi - 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type PSEUDO STATIC RAM - PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM
memory width 16 - 16 16 16 16 16
Number of functions 1 - 1 1 1 1 1
Number of terminals 48 - 48 48 48 48 48
word count 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 - 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C 70 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -40 °C -25 °C - -25 °C -
organize 512KX16 - 512KX16 512KX16 512KX16 512KX16 512KX16
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA48,6X8,30 - BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3 V - 2.5/3 V 2.5/3 V 2.5/3 V 2.5/3 V 2.5/3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00007 A - 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A
Maximum slew rate 0.02 mA - 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V - 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES - YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL OTHER COMMERCIAL OTHER COMMERCIAL
Terminal surface TIN SILVER COPPER - TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL - BALL BALL BALL BALL BALL
Terminal pitch 0.75 mm - 0.75 mm 0.75 mm 0.75 mm 0.75 mm 0.75 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Remote Video Monitoring System Based on ARM-Linux and CDMA
Introduction CDMA (Code Division Multiple Access) wireless network has the characteristics of wide coverage, high efficiency and low cost. The data transmission rate of CDMA network can reach 200kb/s....
clj2004000 MCU
Is the sudden itching on the face due to skin allergies?
Is the sudden itching on the face due to skin allergies? Yesterday morning, I felt something was wrong when I woke up, and I always wanted to scratch it with my hands. Have you ever experienced this?...
gurou1 Talking
Data 16-bit ADS1115AVR program data
[i=s] This post was last edited by paulhyde on 2014-9-15 03:09 [/i] About 2011 Electronics Competition Texas Instruments AD DA Information...
地底下的蘑菇 Electronics Design Contest
A Fortune 500 company (Shanghai) is looking for a .net software engineer
Job Description: 1. Bachelor degree or above, major in computer related; 2. At least three years or more of .net development, familiar with vb; 3. Proficient in English....
gladito Embedded System
How to install the standard SDK emulator
I downloaded the standard wince 5.0 standard SDK from the official website, but I can only debug the real machine directly in VS2005. I want to use the simulator, but I don't know how to use it....
gmfeng Embedded System
Let’s make a prediction: 5G construction will accelerate at the end of the year, so will there be a wave of demand?
In the first half of this year, the three major operators all slowed down their 5G construction, but after entering the second half of the year, the operators all stated that they would maintain their...
他们逼我做卧底 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 257  2617  697  2079  348  6  53  15  42  7 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号