HYM64V1005GCD-60 datasheet, PDF

Datasheet> All Categories > storage> storage> HYM64V1005GCD-60

HYM64V1005GCD-60: DescriptionEDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144; Categorystorage storage; File Size78KB，15 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

Download Datasheet Parametric Compare View All

HYM64V1005GCD-60 Overview

EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144

HYM64V1005GCD-60 Parametric

Parameter Name	Attribute value
Maker	Infineon
Parts packaging code	SODIMM
package instruction	DIMM, DIMM144,32
Contacts	144
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	60 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	COMMON
JESD-30 code	R-XZMA-N144
memory density	67108864 bit
Memory IC Type	EDO DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	144
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,32
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	25.4 mm
self refresh	NO
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	ZIG-ZAG

Preview

Download Datasheet

View All

3.3V DRAM Modules

144 pin SO-DIMM EDO-DRAM Modules

8MB , 16MB, 32MB & 64MB density

HYM64Vx005GCD(L)-60

•

144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Modules with 8 Byte busses

for PC notebook applications

Chip-on Board (COB) Assembly Technique

One bank 1M x 64, 2M x 64, 4M x 64 and 8M x 64 non-parity module organisations

Performance:

-60

tRAC

tCAC

tAA

tRC

tHPC

RAS Access Time

CAS Access Time

Access Time from Address

Cycle Time

EDO Mode Cycle Time

60 ns

15 ns

30 ns

104 ns

25 ns

•

Single +3.3V(± 0.3V ) power supply

CAS-before-RAS refresh, RAS-only-refresh

L-versions use low power DRAMs and support Self Refresh („ leep mode“

)

Decoupling capacitors mounted on substrate

All inputs, outputs are LVTTL compatible

Optional serial presence detect

Gold contact pad

Semiconductor Group

12.97

HYM64V1005GCD-60 Related Products

	HYM64V1005GCD-60	HYM64V8005GCDL-60	HYM64V4005GCDL-50	HYM64V8005GCDL-50	HYM64V2005GCDL-60	HYM64V8005GCD-60	HYM64V1005GCDL-50	HYM64V4005GCDL-60	HYM64V2005GCDL-50	HYM64V1005GCDL-60
Description	EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144	EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144	EDO DRAM Module, 4MX64, 50ns, CMOS, SODIMM-144	EDO DRAM Module, 8MX64, 50ns, CMOS, SODIMM-144	EDO DRAM Module, 2MX64, 60ns, CMOS, SODIMM-144	EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144	EDO DRAM Module, 1MX64, 50ns, CMOS, SODIMM-144	EDO DRAM Module, 4MX64, 60ns, CMOS, SODIMM-144	EDO DRAM Module, 2MX64, 50ns, CMOS, SODIMM-144	EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144
Parts packaging code	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM
package instruction	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM,	DIMM,	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM,	DIMM, DIMM144,32	DIMM,	DIMM, DIMM144,32
Contacts	144	144	144	144	144	144	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	60 ns	60 ns	50 ns	50 ns	60 ns	60 ns	50 ns	60 ns	50 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/SELF REFRESH
JESD-30 code	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144	R-XZMA-N144
memory density	67108864 bit	536870912 bit	268435456 bit	536870912 bit	134217728 bit	536870912 bit	67108864 bi	268435456 bi	134217728 bi	67108864 bi
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	64	64	64	64	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	144	144	144	144	144	144	144	144	144	144
word count	1048576 words	8388608 words	4194304 words	8388608 words	2097152 words	8388608 words	1048576 words	4194304 words	2097152 words	1048576 words
character code	1000000	8000000	4000000	8000000	2000000	8000000	1000000	4000000	2000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX64	8MX64	4MX64	8MX64	2MX64	8MX64	1MX64	4MX64	2MX64	1MX64
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	NO	YES	YES	YES	YES	NO	YES	YES	YES	YES
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG
Maker	Infineon	-	-	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon	Infineon
I/O type	COMMON	COMMON	-	-	COMMON	COMMON	-	COMMON	-	COMMON
Output characteristics	3-STATE	3-STATE	-	-	3-STATE	3-STATE	-	3-STATE	-	3-STATE
Encapsulate equivalent code	DIMM144,32	DIMM144,32	-	-	DIMM144,32	DIMM144,32	-	DIMM144,32	-	DIMM144,32
power supply	3.3 V	3.3 V	-	-	3.3 V	3.3 V	-	3.3 V	-	3.3 V
refresh cycle	1024	4096	-	-	2048	4096	-	4096	-	1024
Terminal pitch	0.8 mm	0.8 mm	-	-	0.8 mm	0.8 mm	-	0.8 mm	-	0.8 mm

Recommended Resources

LA4185 power amplifier circuit diagram

Simplified equivalent circuit of high frequency common emitter stage

Electric bicycle Jiateng charger circuit diagram

temperature controller circuit

Tube amplifier TDA1543 DAC-2 circuit diagram

875p computer motherboard circuit diagram_018

I need help with the microcontroller program. Please help me find out where the problem is.: //*************************************** // Use single-chip microcomputer STC89C51 // Crystal oscillator: 11.0592M // Display: LCD1602 // Compilation environment Keil uVision3 // Refer to the 24c04 c...; 博弈 51mcu

Development of TI LM3S8962 based on LabVIEW graphical interface--the first step: The first step, the preface! ~ This is the first time I write a development document. If there are any parts that are not well written, please forgive me. I will write more in the next two days. I wil...; wanghongyang Microcontroller MCU

Differences between projects in two versions of KEIL MDK: I have been perfecting a project these past two days. The project is getting bigger and bigger. Suddenly, when I tested it on the computer, I found that several functions became abnormal. So I returne...; fsyicheng stm32/stm8

How to do CGI on LM3S8962?: Hey guys, how do you do CGI on LM3S8962?...; ZHANGXUEJIE Microcontroller MCU

Download problem of lpc1769: I bought an nxp board not long ago. LPC1769 comes with an emulator LPC-LINK and LPCXpresso compilation environment. It can be downloaded and debugged with a USB cable. The download and programming wer...; 258844027 NXP MCU

How to build an NDK project based on C6455?: [align=left][color=#000][size=4]I just started learning how to use NDK, and I don't know where to start with many things. [/size][/color][/align][align=left][color=#000][size=4]I would like to ask how...; 雨晨mouse DSP and ARM Processors

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components