MC14067BALD datasheet, PDF - EEWORLD Datasheet

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MC14067BALD: DescriptionIC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC; CategoryAnalog mixed-signal IC The signal circuit; File Size866KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14067BALD Overview

IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC

MC14067BALD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SINGLE-ENDED MULTIPLEXER
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Number of channels	16
Number of functions	1
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC14067BALD Related Products

	MC14067BALD	MC14067BCPD	MC14067BALDS	MC14097BCPD	MC14097BCLD	MC14097BCLDS
Description	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,PLASTIC	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC	IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,PLASTIC	IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC	IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of channels	16	16	16	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24
Maximum operating temperature	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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