IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MC14097BCLDS | MC14067BCPD | MC14067BALD | MC14067BALDS | MC14097BCPD | MC14097BCLD | |
|---|---|---|---|---|---|---|
| Description | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC | IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,PLASTIC | IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC | IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,PLASTIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of channels | 8 | 16 | 16 | 16 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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