M5M51T08AVP-55SLT datasheet, PDF

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M5M51T08AVP-55SLT: DescriptionStandard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32; Categorystorage storage; File Size237KB，7 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M5M51T08AVP-55SLT Overview

Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32

M5M51T08AVP-55SLT Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	TSOP1
package instruction	SOP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	R-PDSO-G32
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal location	DUAL

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	M5M51T08AVP-55SLT	M5M51T08AP-55SL	M5M51T08ARV-55SL	M5M51T08ARV-55SLT	M5M51T08AVP-55SL	M5M51T08AFP-55SLT	M5M51T08AFP-55SL
Description	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP1-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP1-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
Parts packaging code	TSOP1	DIP	TSOP1	TSOP1	TSOP1	SOIC	SOIC
package instruction	SOP,	DIP, DIP32,.6	SOP, TSSOP32,.8,20	SOP,	SOP, TSSOP32,.8,20	SOP,	SOP, SOP32,.56
Contacts	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns
JESD-30 code	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP	SOP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Mitsubishi	-	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
Is it lead-free?	-	Contains lead	Contains lead	-	Contains lead	-	Contains lead
Is it Rohs certified?	-	incompatible	incompatible	-	incompatible	-	incompatible
I/O type	-	COMMON	COMMON	-	COMMON	-	COMMON
JESD-609 code	-	e0	e0	-	e0	-	e0
Encapsulate equivalent code	-	DIP32,.6	TSSOP32,.8,20	-	TSSOP32,.8,20	-	SOP32,.56
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
power supply	-	5 V	5 V	-	5 V	-	5 V
Maximum standby current	-	0.000002 A	0.000002 A	-	0.000002 A	-	0.000002 A
Maximum slew rate	-	0.09 mA	0.09 mA	-	0.09 mA	-	0.09 mA
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal pitch	-	2.54 mm	0.5 mm	-	0.5 mm	-	1.27 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED

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