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5962-9461403H9X

Description
EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
Categorystorage    storage   
File Size204KB,14 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9461403H9X Overview

EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68

5962-9461403H9X Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction23.90 MM, CERAMIC, LQFP-68
Reach Compliance Codeunknown
Maximum access time90 ns
Other featuresUSER CONFIGURABLE AS 128K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length23.88 mm
memory density1048576 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals68
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width23.88 mm
Maximum write cycle time (tWC)10 ms
White Electronic Designs
32Kx32 EEPROM MODULE, SMD 5962-94614
FEATURES
Access Times of 80*, 90, 120, 150ns
MIL-STD-883 Compliant Devices Available
Packaging:
• 68 lead, Hermetic CQFP (G2U), 122.4mm
(0.880") square, 3.56mm (0.140") height
(Package 510).
• 68 lead, Hermetic CQFP (G1U)
1
, 23.9mm
(0.940") square, 3.56mm (0.140") high (Pack
age 519)
• 68 lead, Hermetic CQFP (G1T), 23.9mm
(0.940") square, 4.06mm (0.160"), (Package
524)
• 66-pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
WE32K32-XXX
Data Retention at 25°C, 10 Years
Write Endurance, 10,000 Cycles
Organized as 32Kx32; User Configurable 64Kx16
or 128Kx8
Commercial, Industrial and Military Temperature
Ranges
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Low Power CMOS, 10mA Standby Typical
Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
* 80ns speed is not fully characterized and is subject to change or
cancellation without notice.
NOTE 1: Package not recommended for new design
FIG. 1
PIN CONFIGURATION FOR WE32K32N-XH1X
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
NC
NC
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
32K x 8
32K x 8
OE
A
0-14
32K x 8
32K x 8
W E
1
CS
1
P
IN
D
ESCRIPTION
56
I/O
0-31
Data Inputs/Outputs
A
0-14
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
I/O
20
66
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
October 2002 Rev. 3
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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