MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SHARP |
| package instruction | 0.400 INCH, PLASTIC, TSOP2-32 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| memory density | 2097152 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| LH532100BS | LH532100BT | LH532100BD | LH532100BN | LH532100BSR | LH532100BU | |
|---|---|---|---|---|---|---|
| Description | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32 | MASK ROM, 256KX8, 150ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
| package instruction | 0.400 INCH, PLASTIC, TSOP2-32 | 8 X 20 MM, PLASTIC, TSOP1-32 | 0.600 INCH, PLASTIC, DIP-32 | 0.525 INCH, PLASTIC, SOP-32 | 0.400 INCH, PLASTIC, REVERSE, TSOP2-32 | 0.450 INCH, PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | DIP | SOP | SOP | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | J BEND |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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