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UPD43259ACR-25

Description
IC,SRAM,32KX9,CMOS,DIP,32PIN,PLASTIC
Categorystorage    storage   
File Size126KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

UPD43259ACR-25 Overview

IC,SRAM,32KX9,CMOS,DIP,32PIN,PLASTIC

UPD43259ACR-25 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeDIP
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee0
memory density294912 bit
Memory IC TypeSTANDARD SRAM
memory width9
Number of terminals32
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX9
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.002 A
Minimum standby current4.5 V
Maximum slew rate0.13 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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