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2SK3628

Description
Power Field-Effect Transistor, 20A I(D), 230V, 0.085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TOP-3F-B1, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size62KB,3 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance
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2SK3628 Overview

Power Field-Effect Transistor, 20A I(D), 230V, 0.085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TOP-3F-B1, 3 PIN

2SK3628 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
Avalanche Energy Efficiency Rating (Eas)570 mJ
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage230 V
Maximum drain current (ID)20 A
Maximum drain-source on-resistance0.085 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSFM-T3
Humidity sensitivity level1
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)80 A
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Silver/Bismuth/Copper (Sn/Ag/Bi/Cu)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
Power MOSFETs
2SK3628
Silicon N-channel power MOSFET
(0.7)
Unit: mm
15.0
±0.3
11.0
±0.2
5.0
±0.2
(3.2)
For hihg-speed switching
Features
Avalanche energy capability guaranteed
High-speed switching
Low ON resistance R
on
No secondary breakdown
21.0
±0.5
φ
3.2
±0.1
15.0
±0.2
16.2
±0.5
(3.2) (2.3)
Solder Dip
2.0
±0.2
1.1
±0.1
2.0
±0.1
0.6
±0.2
Absolute Maximum Ratings
T
C
=
25°C
Parameter
Drain-source surrender voltage
Gate-source surrender voltage
Drain current
Peak drain current
Avalanche energy capability
*
Power
dissipation
T
a
=
25°C
T
ch
T
stg
Symbol
V
DSS
V
GSS
I
D
I
DP
EAS
P
D
Rating
230
±30
20
80
570
100
3
150
−55
to
+150
°C
°C
Unit
V
V
A
A
mJ
W
5.45
±0.3
10.9
±0.5
1
2
3
1: Gate
2: Drain
3: Source
TOP-3F-B1 Package
Channel temperature
Storage temperature
Note) *: L
=
2.23 mH, I
L
=
20 A, V
DD
=
50 V, 1 pulse, T
a
=
25°C
Electrical Characteristics
T
C
=
25°C
±
3°C
Parameter
Gate-drain surrender voltage
Diode forward voltage
Gate threshold voltage
Drain-source cutoff current
Gate-source cutoff currentt
Drain-source on resistance
Forward transfer admittance
Short-circuit forward transfer capacitance
(Common-source)
Short-circuit output capacitance
(Common-source)
Reverse transfer capacitance
(Common-source)
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Symbol
V
DSS
V
DSF
V
th
I
DSS
I
GSS
R
DS(on)
Y
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
100 V, I
D
= 15 A
R
L
= 6.7
Ω,
V
GS
= 10 V
Conditions
I
D
=
1 mA, V
GS
=
0
I
DR
=
20 A, V
GS
=
0
V
DS
=
25 V, I
D
=
1 mA
V
DS
=
184 V, V
GS
=
0
V
GS
= ±30
V, V
DS
=
0
V
GS
=
10 V, I
D
=
10 A
V
DS
=
25 V, I
D
=
10 A
V
DS
=
25 V, V
GS
=
0, f
=
1 MHz
7
65
14
2 300
330
30
35
26
220
36
1.7
Min
230
−1.5
3.7
100
±1
85
Typ
Max
Unit
V
V
V
µA
µA
mΩ
S
pF
pF
pF
ns
ns
ns
ns
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: November 2004
SJG00041AED
1

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