Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCF51JF128
Rev. 4, 11/2011
MCF51JF128 Advance
Information
MCF51JF128
Supports the MCF51JF128VLH,
MCF51JF128VHX, MCF51JF128VHS,
MCF51JF64VLF, MCF51JF64VHS,
MCF51JF32VHS, MCF51JF32VFM
Features
• Operating characteristics
– Voltage range: 1.71 V to 3.6 V
– Flash write voltage range: 1.71 V to 3.6 V
– Temperature range (ambient): -40°C to 105°C
• Core
– Up to 50 MHz V1 ColdFire CPU
– Dhrystone 2.1 performance: 1.10 DMIPS per MHz
when executing from internal RAM, 0.99 DMIPS
per MHz when executing from flash memory
• System
– DMA controller with four programmable channels
– Integrated ColdFire DEBUG_Rev_B+ interface with
single-wire BDM connection
• Power management
– 10 low power modes to provide power optimization
based on application requirements
– Low-leakage wakeup unit (LLWU)
– Voltage regulator (VREG)
• Clocks
– Crystal oscillators (two, each with range options): 1
kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8
MHz to 32 MHz (high)
– Multipurpose clock generator (MCG)
• Memories and memory interfaces
– Flash memory, FlexNVM, FlexRAM, and RAM
– Serial programming interface (EzPort)
– Mini-FlexBus external bus interface
• Security and integrity
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random number generator (RNGB)
– Hardware cryptographic acceleration unit (CAU)
– 128-bit unique identification (ID) number per chip
• Analog
– 12-bit SAR ADC
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference (VREF)
• Timers
– Programmable delay block (PDB)
– Motor control/general purpose/PWM timers (FTM)
– 16-bit low-power timers (LPTMRs)
– 16-bit modulo timer (MTIM)
– Carrier modulator transmitter (CMT)
• Communication interfaces
– UARTs with Smart Card support and FIFO
– SPI modules, one with FIFO
– Inter-Integrated Circuit (I2C) modules
– USB full/low speed On-the-Go controller with on-
chip transceiver
– Integrated Interchip Sound (I2S) / Serial Audio
Interface (SAI) to support full-duplex serial
interfaces with frame sync such as AC97 and
CODEC
• Human-machine interface
– Up to 48 EGPIO pins
– Up to 16 rapid general purpose I/O (RGPIO) pins
– Low-power hardware touch sensor interface (TSI)
– Interrupt request pin (IRQ)
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................5
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............6
3.8 Definition: Typical value.....................................................7
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................8
4.2 Moisture handling ratings..................................................8
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................9
5.1 Typical Value Conditions...................................................9
5.2 Nonswitching electrical specifications...............................10
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and Current Operating Requirements......10
LVD and POR operating requirements.................11
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........12
Power consumption operating behaviors..............13
EMC radiated emissions operating behaviors.......16
Designing with radiated emissions in mind...........16
Capacitance attributes..........................................17
5.4.1
5.4.2
Thermal operating requirements...........................19
Thermal attributes.................................................20
6 Peripheral operating requirements and behaviors....................21
6.1 Core modules....................................................................21
6.1.1
Debug specifications.............................................21
6.2 System modules................................................................21
6.3 Clock modules...................................................................21
6.3.1
6.3.2
MCG specifications...............................................21
Oscillator electrical specifications.........................24
6.4 Memories and memory interfaces.....................................26
6.4.1
6.4.2
6.4.3
Flash (FTFL) electrical specifications....................26
EzPort Switching Specifications............................31
Mini-Flexbus Switching Specifications..................32
6.5 Security and integrity modules..........................................34
6.6 Analog...............................................................................35
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications.................................35
CMP and 6-bit DAC electrical specifications.........37
12-bit DAC electrical characteristics.....................40
Voltage reference electrical specifications............43
6.7 Timers................................................................................44
6.8 Communication interfaces.................................................45
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
USB electrical specifications.................................45
USB DCD electrical specifications........................45
USB VREG electrical specifications......................45
SPI switching specifications..................................46
I2S/SAI Switching Specifications..........................50
6.9 Human-machine interfaces (HMI)......................................52
6.9.1
TSI electrical specifications...................................52
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................53
8 Pinout........................................................................................54
8.1 Signal Multiplexing and Pin Assignments..........................54
8.2 Pinout diagrams.................................................................56
8.3 Module-by-module signals.................................................60
9 Revision History........................................................................71
5.3 Switching electrical specifications.....................................17
5.3.1
General Switching Specifications..........................17
5.4 Thermal specifications.......................................................19
MCF51JF128 Advance Information Data Sheet, Rev. 4, 11/2011.
2
Preliminary
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device:
1. Go to
http://www.freescale.com.
2. Perform a part number search for the following partial device numbers: PCF51JF and
MCF51JF.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q CCCC DD MMM T PP
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
Description
Qualification status
Values
• M = Fully qualified, general
market flow
• P = Prequalification
CF51 = ColdFire V1
JF, JU, QF, QH, QM, QU
CCCC
DD
Core code
Device number
Table continues on the next page...
MCF51JF128 Advance Information Data Sheet, Rev. 4, 11/2011.
Freescale Semiconductor, Inc.
Preliminary
3
Terminology and guidelines
Field
MMM
Description
Memory size (program flash memory)
1
Values
• 32 = 32 KB
• 64 = 64 KB
• 128 = 128 KB
V = –40 to 105
• FM = 32 QFN (5 mm x 5 mm)
• HS = 44 Laminate QFN (5 mm x 5
mm)
• LF = 48 LQFP (7 mm x 7 mm)
• HX = 64 Laminate QFN (9 mm x 9
mm)
• LH = 64 LQFP (10 mm x 10 mm)
T
PP
Temperature range, ambient (°C)
Package identifier
1. All parts also have FlexNVM, FlexRAM, and RAM.
2.4 Example
This is an example part number:
MCF51JF128VLH
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
V
DD
Description
1.0 V core supply
voltage
0.9
Min.
1.1
Max.
V
Unit
MCF51JF128 Advance Information Data Sheet, Rev. 4, 11/2011.
4
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
3.2 Definition: Operating behavior
An
operating behavior
is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
I
WP
Description
Digital I/O weak pullup/ 10
pulldown current
Min.
130
Max.
µA
Unit
3.3 Definition: Attribute
An
attribute
is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
3.3.1 Example
This is an example of an attribute:
Symbol
CIN_D
Description
Input capacitance:
digital pins
—
Min.
7
Max.
pF
Unit
3.4 Definition: Rating
A
rating
is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
•
Operating ratings
apply during operation of the chip.
•
Handling ratings
apply when the chip is not powered.
MCF51JF128 Advance Information Data Sheet, Rev. 4, 11/2011.
Freescale Semiconductor, Inc.
Preliminary
5
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