UPD70116GC-8-3B6 datasheet, PDF

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UPD70116GC-8-3B6: DescriptionIC,MICROPROCESSOR,16-BIT,CMOS,QFP,52PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，82 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD70116GC-8-3B6 Overview

IC,MICROPROCESSOR,16-BIT,CMOS,QFP,52PIN,PLASTIC

UPD70116GC-8-3B6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Reach Compliance Code	unknown
bit size	16
JESD-30 code	S-PQFP-G52
JESD-609 code	e0
Number of terminals	52
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP52,.7SQ,40
Package shape	SQUARE
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
speed	8 MHz
Maximum slew rate	80 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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UPD70116GC-8-3B6 Related Products

	UPD70116GC-8-3B6	UPD70116C-5	UPD70116GC-10-3B6	UPD70116GC-5-3B6
Description	IC,MICROPROCESSOR,16-BIT,CMOS,QFP,52PIN,PLASTIC	IC,MICROPROCESSOR,16-BIT,CMOS,DIP,40PIN,PLASTIC	IC,MICROPROCESSOR,16-BIT,CMOS,QFP,52PIN,PLASTIC	IC,MICROPROCESSOR,16-BIT,CMOS,QFP,52PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	unknown	unknown	unknown	unknown
bit size	16	16	16	16
JESD-30 code	S-PQFP-G52	R-PDIP-T40	S-PQFP-G52	S-PQFP-G52
JESD-609 code	e0	e0	e0	e0
Number of terminals	52	40	52	52
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-10 °C	-40 °C	-10 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	DIP	QFP	QFP
Encapsulate equivalent code	QFP52,.7SQ,40	DIP40,.6	QFP52,.7SQ,40	QFP52,.7SQ,40
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	IN-LINE	FLATPACK	FLATPACK
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	8 MHz	5 MHz	10 MHz	5 MHz
Maximum slew rate	80 mA	60 mA	100 mA	60 mA
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1 mm	2.54 mm	1 mm	1 mm
Terminal location	QUAD	DUAL	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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