MC908AP32ACB datasheet, PDF - EEWORLD Datasheet

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MC908AP32ACB: Description8-BIT, FLASH, 8MHz, MICROCONTROLLER, PDIP42, SHRINK, DIP-42; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，314 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC908AP32ACB Overview

8-BIT, FLASH, 8MHz, MICROCONTROLLER, PDIP42, SHRINK, DIP-42

MC908AP32ACB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	DIP
package instruction	SDIP, SDIP42,.6
Contacts	42
Reach Compliance Code	not_compliant
ECCN code	EAR99
Has ADC	YES
Address bus width
bit size	8
CPU series	68HC08
maximum clock frequency	32 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T42
JESD-609 code	e0
length	36.83 mm
Number of I/O lines	30
Number of terminals	42
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP42,.6
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	2048
rom(word)	32768
ROM programmability	FLASH
Maximum seat height	5.08 mm
speed	8 MHz
Maximum slew rate	20 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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MC68HC908AP64A

MC68HC908AP32A

MC68HC908AP16A

MC68HC908AP8A

Data Sheet

M68HC08

Microcontrollers

MC68HC908AP64A

Rev. 1

3/2005

freescale.com

List of Chapters

Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Chapter 2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Chapter 3 Configuration & Mask Option Registers (CONFIG & MOR) . . . . . . . . . . . . . . . . 49

Chapter 4 Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Chapter 5 Oscillator (OSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Chapter 6 Clock Generator Module (CGM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Chapter 7 System Integration Module (SIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Chapter 8 Monitor ROM (MON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Chapter 9 Timer Interface Module (TIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Chapter 10 Timebase Module (TBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

Chapter 11 Serial Communications Interface Module (SCI) . . . . . . . . . . . . . . . . . . . . . . .151

Chapter 12 Infrared Serial Communications Interface Module (IRSCI) . . . . . . . . . . . . . . 177

Chapter 13 Serial Peripheral Interface Module (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Chapter 14 Multi-Master IIC Interface (MMIIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225

Chapter 15 Analog-to-Digital Converter (ADC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .243

Chapter 16 Input/Output (I/O) Ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255

Chapter 17 External Interrupt (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267

Chapter 18 Keyboard Interrupt Module (KBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273

Chapter 19 Computer Operating Properly (COP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279

Chapter 20 Low-Voltage Inhibit (LVI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283

Chapter 21 Break Module (BRK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287

Chapter 22 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293

Chapter 23 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307

Chapter 24 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311

MC68HC908AP A-Family Data Sheet, Rev. 1

Freescale Semiconductor

MC908AP32ACB Related Products

	MC908AP32ACB	MC908AP8ACFB	MC908AP32ACFA	MC908AP16ACFA	MC908AP64ACFA
Description	8-BIT, FLASH, 8MHz, MICROCONTROLLER, PDIP42, SHRINK, DIP-42	8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44	8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP48, PLASTIC, LQFP-48	8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP48, PLASTIC, LQFP-48	8-BIT, FLASH, 8MHz, MICROCONTROLLER, PQFP48, PLASTIC, LQFP-48
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
Parts packaging code	DIP	QFP	QFP	QFP	QFP
package instruction	SDIP, SDIP42,.6	QFP, QFP44,.52SQ,32	LFQFP, QFP48,.35SQ,20	LFQFP, QFP48,.35SQ,20	LFQFP, QFP48,.35SQ,20
Contacts	42	44	48	48	48
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Has ADC	YES	YES	YES	YES	YES
bit size	8	8	8	8	8
CPU series	68HC08	68HC08	68HC08	68HC08	68HC08
maximum clock frequency	32 MHz	32 MHz	32 MHz	32 MHz	32 MHz
DAC channel	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO
JESD-30 code	R-PDIP-T42	S-PQFP-G44	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48
JESD-609 code	e0	e0	e0	e0	e0
length	36.83 mm	10 mm	7 mm	7 mm	7 mm
Number of I/O lines	30	31	32	32	32
Number of terminals	42	44	48	48	48
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	QFP	LFQFP	LFQFP	LFQFP
Encapsulate equivalent code	SDIP42,.6	QFP44,.52SQ,32	QFP48,.35SQ,20	QFP48,.35SQ,20	QFP48,.35SQ,20
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE
Package form	IN-LINE, SHRINK PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	220	220	220	220
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	2048	1024	2048	1024	2048
rom(word)	32768	8192	32768	16384	62368
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	5.08 mm	2.45 mm	1.6 mm	1.6 mm	1.6 mm
speed	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum slew rate	20 mA	20 mA	20 mA	20 mA	20 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.778 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	30	30	30	30
width	15.24 mm	10 mm	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Humidity sensitivity level	-	1	1	1	1

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