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FM27C010VE120

Description
OTP ROM, 128KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size379KB,10 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

FM27C010VE120 Overview

OTP ROM, 128KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32

FM27C010VE120 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.995 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.455 mm
FM27C010 1,048,576-Bit (128K x 8) High Performance CMOS EPROM
December 2000
FM27C010
1,048,576-Bit (128K x 8) High Performance
CMOS EPROM
General Description
The FM27C010 is a high performance, 1,048,576-bit Electrically
Programmable UV Erasable Read Only Memory. It is organized
as 128K-words of 8 bits each. Its pin-compatibility with byte-wide
JEDEC EPROMs enables upgrades through 8 Mbit EPROMs.
The “Don’t Care” feature during read operations allows memory
expansions from 1M to 8M bits with no printed circuit board
changes.
The FM27C010 can directly replace lower density 28-pin EPROMs
by adding an A16 address line and V
CC
jumper. During the normal
read operation PGM and V
PP
are in a “Don’t Care” state which
allows higher order addresses, such as A17, A18, and A19 to be
connected without affecting the normal read operation. This
allows memory upgrades to 8M bits without hardware changes.
The FM27C010 is also offered in a 32-pin plastic DIP with the
same upgrade path.
The FM27C010 provides microprocessor-based systems exten-
sive storage capacity for large portions of operating system and
application software. The FM27C010 offers a single chip solution
for the code storage requirements of 100% firmware-based equip-
ment. Frequently-used software routines are quickly executed
from EPROM storage, greatly enhancing system utility.
The FM27C010 is manufactured using Fairchild’s advanced CMOS
AMG™ EPROM technology.
The FM27C010 is one member of a high density EPROM Family
which range in densities up to 4 Megabit.
Features
I
High performance CMOS
— 90, 120, 150 ns access time
I
Fast turn-off for microprocessor compatibility
I
Simplified upgrade path
— V
PP
and PGM are “Don’t Care” during normal read
operation
I
Manufacturers identification code
I
Fast programming
I
JEDEC standard pin configurations
— 32-pin PLCC package
— 32-pin CERDIP package
Block Diagram
V
CC
GND
V
PP
OE
CE
PGM
Output Enable,
Chip Enable, and
Program Logic
Data Outputs O
0
- O
7
Output
Buffers
Y Decoder
..
1,048,576-Bit
Cell Matrix
A
0
- A
16
Address
Inputs
.......
X Decoder
DS800032-1
© 2000 Fairchild Semiconductor Corporation
FM27C010 Rev. A.1
1
www.fairchildsemi.com

FM27C010VE120 Related Products

FM27C010VE120 FM27C010Q120 FM27C010QE150 FM27C010VE150 FM27C010VE90 FM27C010QE90
Description OTP ROM, 128KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 128KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERDIP-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
Parts packaging code QFJ DIP DIP QFJ QFJ DIP
package instruction QCCJ, LDCC32,.5X.6 WDIP, DIP32,.6 WDIP, DIP32,.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 WINDOWED, CERDIP-32
Contacts 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 120 ns 150 ns 150 ns 90 ns 90 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-GDIP-T32 R-GDIP-T32 R-PQCC-J32 R-PQCC-J32 R-GDIP-T32
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type OTP ROM UVPROM UVPROM OTP ROM OTP ROM UVPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -40 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED
encapsulated code QCCJ WDIP WDIP QCCJ QCCJ WDIP
Encapsulate equivalent code LDCC32,.5X.6 DIP32,.6 DIP32,.6 LDCC32,.5X.6 LDCC32,.5X.6 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE, WINDOW IN-LINE, WINDOW CHIP CARRIER CHIP CARRIER IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 5.969 mm 5.969 mm 3.56 mm 3.56 mm 5.969 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE J BEND J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL DUAL QUAD QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.455 mm 15.24 mm 15.24 mm 11.455 mm 11.455 mm 15.24 mm
Base Number Matches - 1 1 1 1 -

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