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BL-XE1361

Description
Single Color LED, High Efficiency Red, Water Clear, T-3/4, 1.8mm, AXIAL PACKAGE-2
CategoryLED optoelectronic/LED    photoelectric   
File Size306KB,5 Pages
ManufacturerBRIGHT
Websitehttp://www.brightled.co.kr/
Download Datasheet Parametric View All

BL-XE1361 Overview

Single Color LED, High Efficiency Red, Water Clear, T-3/4, 1.8mm, AXIAL PACKAGE-2

BL-XE1361 Parametric

Parameter NameAttribute value
MakerBRIGHT
package instructionAXIAL PACKAGE-2
Reach Compliance Codeunknown
colorHIGH EFFICIENCY RED
ConfigurationSINGLE
Maximum forward current0.03 A
Lens typeWATER CLEAR
Nominal luminous intensity40.0 mcd
Installation featuresAXIAL MOUNT
Number of functions1
Number of terminals2
Maximum operating temperature80 °C
Minimum operating temperature-25 °C
Optoelectronic device typesSINGLE COLOR LED
method of packingBULK
peak wavelength640 nm
shapeROUND
size1.8 mm
surface mountNO
T codeT-3/4
perspective35 deg

BL-XE1361 Preview

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XE1361
Features:
1. Emitted Color: Hi-Eff Red.
2. Lens Appearance: Water Clear.
3. Low cost plastic package.
4. This product doesn’t contain restriction
Substance, comply ROHS standard.
Package Dimensions:
Applications:
1.
2.
3.
Automotive: Dashboards, stop lamps,
turn signals.
Backlighting: LCDs, Key pads advertising.
Status indicators: Comsumer & industrial
electronics.
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
4.
General use.
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current
*1
Reverse Volage
Symbol
Pd
I
F
I
FP
Rating
80
30
100
5
Unit
mW
mA
mA
V
-
-
-
Operating Temperature
Storage Temperature
Soldering Temperature
½鴻工業股½有限公司
http://www.brtled.com
V
R
Topr
Tstg
Tsol
-25℃~80℃
-30℃~85℃
See Page 4
*1
Condition for
I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.2.0 Page 1 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XE1361
Electrical and optical characteristics(Ta=25℃)
Parameter
Forward Voltage
Luminous Intensity
Reverse Current
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Veiwing Angle
Symbol
Vf
Iv
I
R
λp
λd
Δλ
1/2
Condition
I
F
=20mA
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Min.
-
18.5
-
-
626
-
-
Typ.
2.0
40
-
640
-
40
35
Max.
2.6
-
100
-
636
-
-
Unit
V
mcd
µA
nm
nm
nm
deg
Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
Fig.1 Relative intensity vs. wavelength
1.0
60
vs. ambient temperature
50
Relative radiant intensity
Forward current (mA)
40
0.5
30
20
10
0
0
640
690
590
20
40
60
80
100
Wavelength (nm)
Ambient temperature Ta( C)
Fig.3 Forward current vs. forward voltage
50
3.0
Fig.4 Relative luminous intensity vs.
ambient temperature
40
Relative Luminous intensity
(Normalized @20mA)
2.5
Forward current (mA)
2.0
30
1.5
20
1.0
10
0.5
0
1
2
3
4
5
0
-40
-20
0
20
40
60
Forward voltage(V)
A
Ambient temperature Ta( C)
Relative luminous intensity (@20mA)
Relative radiant intensity
½鴻工業股½有限公司
http://www.brtled.com
Fig.6 Radiation diagram
0
10
Fig.5 Relative luminous intensity vs. forward current
4.0
20
30
3.0
1.0
40
2.0
0.9
0.8
50
60
70
1.0
0.7
80
90
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.2.0 Page 2 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XE1361
Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021
:B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS-C-7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS-C-7021
:B-10
Storage
Low
Temperature JIS-C-7021
:B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021
:A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS-C-7021
:A-1
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
High Ta=+85℃±5℃
Test time=1,000hrs
Low Ta=-35℃±5℃
Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
260℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
0/20
Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
V
F
( V)
I
R
(uA)
Iv ( mcd )
Measuring conditions
I
F
=20mA
V
R
=5V
I
F
=20mA
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
½鴻工業股½有限公司
http://www.brtled.com
S means initial value.
2. Measurment shall be taken between 2 hours and after the test pieces have been returned
to normal ambient conditions after completion of each test.
Ver.2.0 Page 3 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XE1361
Soldering :
1. Manual of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3.
DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
Soldering heat Max. 260
120~150℃
245
±5℃
within 5 sec.
Temperature
Preheat
120~180 sec.
½鴻工業股½有限公司
http://www.brtled.com
Time
Ver.2.0 Page 4 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XE1361
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60℃±3℃.
Package and Label of Products:
(1) Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
½鴻工業股½有限公司
http://www.brtled.com
x
xx
xx
Year Month
Manufacture Location
Sealing Date
xx
Day
Ver.2.0 Page 5 of 5
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