Thin Film Chip Inductor
AL Series
Features
•
•
•
•
•
•
Photolithographic single layer ceramic chip
High SRF, excellent Q, superior temperature stability
Tight tolerance of ± 1% or ± 0.1nH
Self resonant frequency controlled within 10%
Stable inductance in high frequency circuit
Highly stable design for critical needs
Applications
• Cellular Telephone, Pagers and GPS Products
• VCO, TCXO Circuit and RF Transceiver Module
• Wireless LAN, Bluetooth Module, Communication Appliances
Construction
1
2
3
4
Alumina Substrate
Inner Electrode (Ni-Cr)
Barrier Layer (Ni)
External Electrode (Sn)
5
6
7
8
Edge Electrode
Cu Circuits
Overcoat
Marking
Dimensions
Size
(Inch)
0201
0402
A
0.6 ± 0.05
1 ± 0.05
B
0.3 ± 0.05
0.5 ± 0.05
C
0.23 ± 0.05
0.32 ± 0.05
D
0.15 ± 0.05
0.2 ± 0.1
Weight
(g)
(1,000pcs)
0.3
0.9
Dimensions: mm
www.element14.com
www.farnell.com
www.newark.com
Page <1>
17/05/12
V1.0
Thin Film Chip Inductor
AL Series
Environmental Characteristics
Item
Inductance
Requirement
As Spec.
Test Method
Measuring equipment and fixture:
0201: HP4287 + Agilent 16196C
0402: HP4287 + Agilent 16196B
Apply 100V
dc
for 1minute
40 ± 2°C, 90 ~ 95% R.H. Max. working voltage for 1,000 hrs
with 1.5 hrs “ON” and 0.5 hrs “OFF”
Bending Amplitude 3mm for 10 seconds
245 ± 5°C for 3 seconds
260 ± 5°C for 10 seconds
Apply 100VA (rms) for 1minute
85 ± 2°C, 1,000 +48/-0 hours
ΔL ≤ 10%
-40 ± 3°C, 1,000 +48/-0 hours
-40 / RT / 85 / RT, 10 cycles
Insulation Resistance
Damp Heat with Load
Bending Strength
Solderability
Resistance to Soldering Heat
Dielectric Withstand Voltage
High Temperature Exposure
Low Temperature Storage
Temperature Cycle
> 1,000MΩ
ΔL ≤ 10%
As Spec.
95% min. coverage
ΔL ≤ 10%
> 100V
Reference Standards: MIL-STD-202F, JIS-C 5201-1
Storage Temperature : 25 ± 3°C; Humidity < 80%RH
Packaging
Reel Specifications & Packaging Quantity
Size
(Inch)
0201
0402
ψA
178 ± 1.0
ψB
60 + 1
ψC
13.5 ± 0.7
W
9.5 ± 1
T
11.5 ± 1
Quantity
(EA)
10,000
Dimensions: mm
www.element14.com
www.farnell.com
www.newark.com
Page <5>
17/05/12
V1.0