Numonyx™ Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus Data
Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware block
protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic Power
Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
— 64 bit unique device identifier
— 64 bit user programmable OTP cells
Extended Cycling Capability
— Minimum 100,000 block erase cycles
Software
— Supported by Numonyx Advanced Flash
File Managers -- Numonyx™ VFM,
Numonyx™ FDI, etc.
— Code and data storage in the same
memory device
— Robust Power Loss Recovery for Data Loss
Prevention
— Common Flash Interface
Standard Surface Mount Packaging
— 48-Ball
μBGA*/VFBGA
— 64-Ball Easy BGA packages
— 48-TSOP package
Intel ETOX* VIII (0.13
μm)
Flash Technology
— 8, 16, 32 Mbit
Intel ETOX* VII (0.18
μm)
Flash Technology
— 16, 32 Mbit
Intel ETOX* VI (0.25
μm)
Flash Technology
— 8, 16 and 32 Mbit
290645-24
March 2008
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx
products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Legal Lines and Disclaimers
Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.
Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented
subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or
otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting the
Numonyx website at
http://www.numonyx.com.
Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2008, Numonyx B.V., All Rights Reserved.
Datasheet
2
March 2008
290645-24
C3 Discrete
Contents
1.0
Introduction
.............................................................................................................. 7
1.1
Nomenclature ..................................................................................................... 7
1.2
Conventions ....................................................................................................... 8
Functional Overview
.................................................................................................. 9
2.1
Product Overview ................................................................................................ 9
2.2
Block Diagram .................................................................................................. 10
2.3
Memory Map..................................................................................................... 10
Package Information
............................................................................................... 13
3.1
mBGA* and VF BGA Package .............................................................................. 13
3.2
TSOP Package................................................................................................... 14
3.3
Easy BGA Package............................................................................................. 15
Ballout and Signal Descriptions
............................................................................... 16
4.1
48-Lead TSOP Package ...................................................................................... 16
4.2
64-Ball Easy BGA Package .................................................................................. 19
4.3
Signal Descriptions ............................................................................................ 19
Maximum Ratings and Operating Conditions............................................................
21
5.1
Absolute Maximum Ratings................................................................................. 21
5.2
Operating Conditions ......................................................................................... 21
Electrical Specifications
........................................................................................... 23
6.1
Current Characteristics....................................................................................... 23
6.2
DC Voltage Characteristics.................................................................................. 24
AC Characteristics
................................................................................................... 26
7.1
AC Read Characteristics ..................................................................................... 26
7.2
AC Write Characteristics ..................................................................................... 30
7.3
Erase and Program Timings ................................................................................ 34
7.4
AC I/O Test Conditions....................................................................................... 34
7.5
Device Capacitance ........................................................................................... 35
Power and Reset Specifications
............................................................................... 36
8.1
Active Power (Program/Erase/Read) .................................................................... 36
8.2
Automatic Power Savings (APS) .......................................................................... 36
8.3
Standby Power.................................................................................................. 36
8.4
Deep Power-Down Mode..................................................................................... 36
8.5
Power and Reset Considerations .......................................................................... 37
8.5.1 Power-Up/Down Characteristics................................................................ 37
8.5.2 RP# Connected to System Reset .............................................................. 37
8.5.3 VCC, VPP and RP# Transitions.................................................................. 37
8.5.4 Reset Specifications................................................................................ 37
8.6
Power Supply Decoupling ................................................................................... 38
Device Operations
................................................................................................... 39
9.1
Bus Operations ................................................................................................. 39
9.1.1 Read .................................................................................................... 39
9.1.2 Write .................................................................................................... 39
9.1.3 Output Disable ....................................................................................... 39
9.1.4 Standby ................................................................................................ 39
9.1.5 Reset.................................................................................................... 40
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Modes of Operation
................................................................................................. 41
March 2008
290645-24
Datasheet
3
C3 Discrete
10.1
10.2
10.3
Read Mode........................................................................................................41
10.1.1 Read Array ............................................................................................41
10.1.2 Read Identifier .......................................................................................41
10.1.3 CFI Query ..............................................................................................42
10.1.4 Read Status Register...............................................................................42
10.1.4.1 Clear Status Register .................................................................43
Program Mode...................................................................................................43
10.2.1 12-Volt Production Programming ..............................................................43
10.2.2 Suspending and Resuming Program ..........................................................44
Erase Mode .......................................................................................................44
10.3.1 Suspending and Resuming Erase ..............................................................44
11.0 Security Modes
........................................................................................................48
11.1 Flexible Block Locking.........................................................................................48
11.1.1 Locking Operation...................................................................................48
11.1.1.1 Locked State ............................................................................49
11.1.1.2 Unlocked State .........................................................................49
11.1.1.3 Lock-Down State.......................................................................49
11.2 Reading Block-Lock Status ..................................................................................49
11.3 Locking Operations during Erase Suspend .............................................................49
11.4 Status Register Error Checking ............................................................................50
11.5 128-Bit Protection Register .................................................................................50
11.5.1 Reading the Protection Register ................................................................50
11.5.2 Programming the Protection Register.........................................................51
11.5.3 Locking the Protection Register.................................................................51
11.6 V
PP
Program and Erase Voltages ..........................................................................51
11.6.1 Program Protection .................................................................................51
Datasheet
4
March 2008
290645-24
C3 Discrete
Revision History
Date of
Revision
05/12/98
Version
-001
Original version
Description
07/21/98
-002
48-Lead TSOP package diagram change
μBGA
package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
I
PPD
test conditions clarification (Section 4.3)
μBGA
package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
V
IH
Specification change (Section 4.3)
V
IL
Maximum Specification change (Section 4.3)
I
CCS
test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from
3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
Added t
BHWH
/t
BHEH
and t
QVBL
(Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart
changed (Appendix B)
Added t
WHGL
(Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max I
CCD
changed to 25 µA
Table 10, added note indicating V
CC
Max = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25μm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
Complete technical update.
10/03/98
-003
12/04/98
12/31/98
02/24/99
-004
-005
-006
06/10/99
-007
03/20/00
04/24/00
-008
-009
10/12/00
-010
7/20/01
-011
10/02/01
2/05/02
-012
-013
4/05/02
-014
3/06/03
-016
March 2008
290645-24
Datasheet
5
Microcontroller MCU
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