|
LMV981BL/NOPB |
LMV981BLX/NOPB |
| Description |
OP-AMP, 4000uV OFFSET-MAX, 1.4MHz BAND WIDTH, PBGA6, 1.006 X 1.514 MM, 0.945 MM HEIGHT, MICRO, MO-211BB, SMD- 6 |
OP-AMP, 4000uV OFFSET-MAX, 1.4MHz BAND WIDTH, PBGA6, 1.006 X 1.514 MM, 0.945 MM HEIGHT, MICRO, MO-211BB, SMD- 6 |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| package instruction |
TFBGA, |
TFBGA, |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Maximum average bias current (IIB) |
0.035 µA |
0.035 µA |
| Nominal Common Mode Rejection Ratio |
81 dB |
81 dB |
| Maximum input offset voltage |
4000 µV |
4000 µV |
| JESD-30 code |
R-PBGA-B6 |
R-PBGA-B6 |
| length |
1.514 mm |
1.514 mm |
| Humidity sensitivity level |
1 |
1 |
| Number of functions |
1 |
1 |
| Number of terminals |
6 |
6 |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TFBGA |
TFBGA |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.045 mm |
1.045 mm |
| Nominal slew rate |
0.4 V/us |
0.4 V/us |
| Supply voltage upper limit |
5.5 V |
5.5 V |
| Nominal supply voltage (Vsup) |
2.7 V |
2.7 V |
| surface mount |
YES |
YES |
| Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth |
1400 kHz |
1400 kHz |
| width |
1.006 mm |
1.006 mm |