Glass tube, nickel-plated brass endcap construction
UL Listed product meets standard 248-14
UL Listed Card: AGC
1
⁄
20
-10
UL Recognition Card: AGC 11-40
CSA Component Acceptance Card (Class No. 1422 30)
CSA Certification Card (Class No. 1422 01)
Agency Information
Environmental Data
• Shock:
1
⁄
20
-
3
⁄
4
A – MIL-STD-202, Method 213, Test Condition I; 1 - 30A –
MIL-STD-202, Method 207, (HI Shock)
• Vibration:
1
⁄
20
- 30A – MIL-STD-202,Method 204, Test Condition A
(Except 5g, 500Hz)
Ordering
• Specify packaging code prefix, part number and option code suffix
(if applicable)
Specifications
• See page 2
1113
BU-SB131067
Page 1 of 3
Data Sheet 2543
Non-RoHS
Part Number
AGC-
1
⁄
20
AGC-
1
⁄
10
AGC-
1
⁄
8
AGC-
3
⁄
16
AGC-
2
⁄
10
AGC-
1
⁄
4
AGC-
3
⁄
10
AGC-
3
⁄
8
AGC-
1
⁄
2
AGC-
3
⁄
4
AGC-1
AGC-1-
1
⁄
4
AGC-1-
1
⁄
2
AGC-2
AGC-2-
1
⁄
4
AGC-2-
1
⁄
2
AGC-3
AGC-4
AGC-5
AGC-6
AGC-7
AGC-7-
1
⁄
2
AGC-8
AGC-9
AGC-10
AGC-12
AGC-14
AGC-15
AGC-20
AGC-25
AGC-30
AGC-35
AGC-40
RoHS
Part Number
AGC-
1
⁄
20
-R
AGC-
1
⁄
10
-R
AGC-
1
⁄
8
-R
AGC-
3
⁄
16
-R
AGC-
2
⁄
10
-R
AGC-
1
⁄
4
-R
AGC-
3
⁄
10
-R
AGC-
3
⁄
8
-R
AGC-
1
⁄
2
-R
AGC-
3
⁄
4
-R
AGC-1-R
AGC-1-
1
⁄
4
-R
AGC-1-
1
⁄
2
-R
AGC-2-R
AGC-2-
1
⁄
4
-R
AGC-2-
1
⁄
2
-R
AGC-3-R
AGC-4-R
AGC-5-R
AGC-6-R
AGC-7-R
AGC-7-
1
⁄
2
-R
AGC-8-R
AGC-9-R
AGC-10-R
AGC-12-R
AGC-14-R
AGC-15-R
AGC-20-R
AGC-25-R
AGC-30-R
AGC-35-R
AGC-40-R
AC Voltage
Rating
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
32
32
32
32
32
32
32
32
SPECIFICATIONS
AC Interrupting Rating (amps)
250
125
32
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
35
10,000
—
100
10,000
—
100
10,000
—
100
10,000
—
100
10,000
—
100
10,000
—
100
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
200
10,000
—
—
—
1000
—
—
1000
—
—
1000
—
—
1000
—
—
1000
—
—
1000
—
—
70
—
—
80
Typical DC Cold
Resistance* (Ω)
4.500
12.565
6.800
4.900
3.360
2.300
1.670
1.203
0.615
0.312
0.190
0.145
0.115
0.078
0.067
0.057
0.045
0.030
0.024
0.020
0.017
0.0146
0.014
0.012
0.008
0.0070
0.0062
0.006
0.004
0.003
0.002
0.0014
0.0019
Typical Melting
I
2
t
†
AC
0.00773
0.000787
0.00131
0.00637
0.00435
0.0148
0.0208
0.0321
0.269
0.815
1.615
0.018
0.0149
0.00509
0.00588
0.00879
0.0167
0.0305
0.045
0.071
0.105
—
0.152
0.21
0.492
—
—
0.566
1.438
2.109
3.807
—
—
Typical Voltage
Drop
‡
0.67
6.00
4.67
4.12
4.51
0.89
2.88
4.59
0.59
0.37
0.31
0.35
0.27
0.28
0.26
0.31
0.25
0.22
0.23
0.23
0.23
—
0.19
0.18
0.20
—
—
0.14
0.12
0.11
0.12
—
—
* DC Cold Resistance (Measured at ≤10% of rated current)
† Typical Melting I
2
t (A
2
Sec) (I
2
t was measured at listed interrupting rating and rated voltage.)
‡ Typical Voltage Drop (Voltage drop was measured at 25°C ambient temperature at rated current)
1113
BU-SB131067
Page 2 of 3
Data Sheet 2543
Time-Current Curves
TIME IN SECONDS
CURRENT IN AMPERES
Packaging Code Prefix
Code
BK
BK1
BK8
Code
B
V
-R
Description
100 pieces of fuses packed into a cardboard carton with flaps folded
1000 pieces of fuses packed into a cardboard carton with flaps folded
8000 pieces of fuses packed into a cardboard carton with flaps folded
Option Code Suffix
Description
Board Washable - Hermetically sealed to withstand aqueous cleaning
Axial leads - copper tinned wire with nickel-plated brass overcaps
RoHS Compliant version
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended
to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or
construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin.
Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems
are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant
The specific error is as follows: Xst:528 - Multi-source in Unit on signal 127; this signal is connected to multiple drivers.
Xst:528 - Multi-source in Unit on signal126; this signal is connected to m...
Although today's lead-acid batteries have made great improvements in structural design and raw materials compared to the past, and their performance has been greatly improved, many well-designed and w...
[i=s]This post was last edited by dontium on 2015-1-23 13:40[/i]I recently read an article about the high-performance ADC design of Chipsea Technology and I feel that I have gained a lot. In particula...
Now is the post-Chinese New Year, and various job fairs and recruitment advertisements are everywhere. Many of our college students are busy looking for jobs again. As a middle-aged workplace expert, ...
Hello, has anyone used the At89C4051 processor? I made a serial port downloader based on the information on the Internet, but I just can't download it. I hope some friend can give me some instructions...
I installed IIS on my computer first, then I installed vs.net2005, and then I installed SQL Server 2000 (Personal Edition) + SQL Server 2000 SP4. After I installed SP4, I checked the SQL version and i...
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
01. Introduction
As in-vehicle networks migrate from the CAN
bus
to
Ethernet
, traditional millisecond-level synchronization accuracy can no longer meet the requirements of mul...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
