Inverter, CMOS,
| Parameter Name | Attribute value |
| Maker | RCA |
| package instruction | , DIE OR CHIP |
| Reach Compliance Code | unknown |
| Logic integrated circuit type | INVERTER |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | OPEN-DRAIN |
| Encapsulate equivalent code | DIE OR CHIP |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| technology | CMOS |
| Temperature level | MILITARY |

| CD4009UBH | CD4010BE | CD4010BF | CD4009UBE | CD4009UBF | CD4010BH | CD4009UBD | CD4010BK | CD4009UBK | CD4010BD | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Inverter, CMOS, | Buffer, CMOS, PDIP16, | Buffer, CMOS, CDIP16, | Inverter, CMOS, PDIP16, | Inverter, CMOS, CDIP16, | Buffer, CMOS, | Inverter, CMOS, CDIP16, | Buffer, CMOS, CDFP16, | Inverter, CMOS, CDFP16, | Buffer, CMOS, CDIP16, |
| package instruction | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Logic integrated circuit type | INVERTER | BUFFER | BUFFER | INVERTER | INVERTER | BUFFER | INVERTER | BUFFER | INVERTER | BUFFER |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Encapsulate equivalent code | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIE OR CHIP | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Maker | RCA | - | - | RCA | RCA | RCA | RCA | RCA | RCA | RCA |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
| JESD-30 code | - | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | - | R-XDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-XDIP-T16 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| Number of terminals | - | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| Package body material | - | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | - | DIP | DIP | DIP | DIP | - | DIP | DFP | DFP | DIP |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| surface mount | - | NO | NO | NO | NO | - | NO | YES | YES | NO |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |