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SI1002-C-GMR

Description
Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, PQCC42
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,390 Pages
ManufacturerSilicon Laboratories Inc
Environmental Compliance
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SI1002-C-GMR Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, PQCC42

SI1002-C-GMR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSilicon Laboratories Inc
package instructionHVQCCN, LCC42,.2X.27,25/20
Reach Compliance Codeunknown
Has ADCYES
Address bus width
bit size8
CPU series8051
maximum clock frequency30 MHz
DMA channelNO
External data bus width
JESD-30 codeR-PQCC-N42
length7 mm
Number of I/O lines22
Number of terminals42
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC42,.2X.27,25/20
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
power supply1.8/3.6 V
Certification statusNot Qualified
RAM (bytes)4352
rom(word)65536
ROM programmabilityFLASH
speed25 MHz
Maximum slew rate5 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width5 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

SI1002-C-GMR Preview

Si1000/1/2/3/4/5
Ultra Low Power, 64/32 kB, 10-Bit ADC
MCU with Integrated 240–960 MHz EZRadioPRO
®
Transceiver
Ultra Low Power: 0.9 to 3.6 V Operation
-
Typical sleep mode current < 0.1 µA; retains state and
-
-
-
-
EZRadioPRO
®
Transceiver
-
-
-
-
-
Frequency range = 240–960 MHz
Sensitivity = –121 dBm
FSK, GFSK, and OOK modulation
Max output power = +20 dBm (Si1000/1), +13 dBm
(Si1002/3/4/5)
RF power consumption
-
18.5 mA receive
-
18 mA @ +1 dBm transmit
-
30 mA @ +13 dBm transmit
-
85 mA @ +20 dBm transmit
Data rate = 0.123 to 256 kbps
Auto-frequency calibration (AFC)
Antenna diversity and transmit/receive switch control
Programmable packet handler
TX and RX 64 byte FIFOs
Frequency hopping capability
On-chip crystal tuning
RAM contents over full supply range; fast wakeup of < 2 µs
Less than 600 nA with RTC running
Less than 1 µA with RTC running and radio state retained
On-chip dc-dc converter allows operation down to 0.9 V.
Two built-in brown-out detectors cover sleep and active
modes
10-Bit Analog to Digital Converter
-
Up to 300 ksps
-
Up to 18 external inputs
-
External pin or internal VREF (no external capacitor
-
-
-
required)
Built-in temperature sensor
External conversion start input option
Autonomous burst mode with 16-bit automatic averaging
accumulator
Dual Comparators
-
Programmable hysteresis and response time
-
Configurable as interrupt or reset source
-
Low current (< 0.5 µA)
On-Chip Debug
-
On-chip debug circuitry facilitates full-speed, non-intrusive
-
-
-
High-Speed 8051 µC Core
-
Pipelined instruction architecture; executes 70% of instruc-
tions in 1 or 2 system clocks
in-system debug (No emulator required)
Provides breakpoints, single stepping
Inspect/modify memory and registers
Complete development kit
-
-
-
-
-
-
-
Digital Peripherals
-
19 or 16 port I/O plus 3 GPIO pins; Hardware enhanced
-
-
UART, SPI, and I
2
C serial ports available concurrently
Low power 32-bit SmaRTClock
Four general purpose 16-bit counter/timers; six channel
programmable counter array (PCA)
Clock Sources
-
Precision internal oscillators: 24.5 MHz with ±2% accuracy
-
-
-
-
Up to
25 MIPS
throughput with 25 MHz clock
-
Expanded interrupt handler
Memory
-
4352 bytes internal data RAM (256 + 4096)
-
64 kB (Si1000/2/4) or 32 kB (Si1001/3/5) flash; In-system
programmable in 1024-byte sectors—1024 bytes are
reserved in the 64 kB devices
supports UART operation; spread-spectrum mode for
reduced EMI; Low power 20 MHz internal oscillator
External oscillator: Crystal, RC, C, CMOS clock
SmaRTClock oscillator: 32.768 kHz crystal or self-oscillate
Can switch between clock sources on-the-fly; useful in
implementing various power saving modes
Package
-
42-pin QFN (5 x 7 mm)
-
42-pin LGA (5 x 7 mm)
Temperature Range: –40 to +85 °C
ANALOG
PERIPHERALS
A
M
U
X
DIGITAL I/O
UART
SMBus
SPI
PCA
Timer 0
Timer 1
Timer 2
Timer 3
CRC
Port 0
CROSSBAR
EZRadio
PRO
Serial
Interface
Port 1
Port 2
EZRadioPRO
(240–960 MHz)
LNA
10-bit
300 ksps
ADC
+
IREF
+
PA
TEMP
SENSOR
VREF
VREG
Mixer
PGA
ADC
VOLTAGE
COMPARATORS
24.5 MHz PRECISION
INTERNAL OSCILLATOR
External Oscillator
20 MHz LOW POWER
INTERNAL OSCILLATOR
HARDWARE smaRTClock
Digital
Modem
Delta
Sigma
Modulator
Digital
Logic
PLL
HIGH-SPEED CONTROLLER CORE
64/32 kB
ISP FLASH
FLEXIBLE
INTERRUPTS
8051 CPU
(25 MIPS)
DEBUG
CIRCUITRY
4352 B
SRAM
POR
WDT
OSC
Rev. 1.2 11/12
Copyright © 2012 by Silicon Laboratories
Si1000/1/2/3/4/5
Si1000/1/2/3/4/5
2
Rev. 1.2
Si1000/1/2/3/4/5
Table of Contents
1. System Overview ..................................................................................................... 16
1.1. Typical Connection Diagram ............................................................................. 20
1.2. CIP-51™ Microcontroller Core .......................................................................... 21
1.3. Port Input/Output ............................................................................................... 22
1.4. Serial Ports ........................................................................................................ 23
1.5. Programmable Counter Array............................................................................ 23
1.6. 10-bit SAR ADC with 16-bit Auto-Averaging Accumulator
and Autonomous Low Power Burst Mode ........................................................ 24
1.7. Programmable Current Reference (IREF0)....................................................... 25
1.8. Comparators...................................................................................................... 25
2. Ordering Information ............................................................................................... 27
3. Pinout and Package Definitions ............................................................................. 28
4. Electrical Characteristics ........................................................................................ 47
4.1. Absolute Maximum Specifications..................................................................... 47
4.2. MCU Electrical Characteristics .......................................................................... 48
4.3. EZRadioPRO
®
Electrical Characteristics .......................................................... 73
4.4. Definition of Test Conditions for the EZRadioPRO Peripheral .......................... 80
5. 10-Bit SAR ADC with 16-bit Auto-Averaging Accumulator
and Autonomous Low Power Burst Mode............................................................ 81
5.1. Output Code Formatting .................................................................................... 81
5.2. Modes of Operation ........................................................................................... 83
5.3. 8-Bit Mode ......................................................................................................... 88
5.4. Programmable Window Detector....................................................................... 95
5.5. ADC0 Analog Multiplexer .................................................................................. 98
5.6. Temperature Sensor........................................................................................ 100
5.7. Voltage and Ground Reference Options ......................................................... 103
5.8. External Voltage References........................................................................... 104
5.9. Internal Voltage References ............................................................................ 104
5.10. Analog Ground Reference............................................................................. 104
5.11. Temperature Sensor Enable ......................................................................... 104
5.12. Voltage Reference Electrical Specifications .................................................. 105
6. Programmable Current Reference (IREF0).......................................................... 106
6.1. IREF0 Specifications ....................................................................................... 106
7. Comparators........................................................................................................... 107
7.1. Comparator Inputs........................................................................................... 107
7.2. Comparator Outputs ........................................................................................ 108
7.3. Comparator Response Time ........................................................................... 109
7.4. Comparator Hysteresis.................................................................................... 109
7.5. Comparator Register Descriptions .................................................................. 110
7.6. Comparator0 and Comparator1 Analog Multiplexers ...................................... 114
8. CIP-51 Microcontroller........................................................................................... 117
8.1. Performance .................................................................................................... 117
8.2. Programming and Debugging Support ............................................................ 118
Rev. 1.2
3
Si1000/1/2/3/4/5
8.3. Instruction Set.................................................................................................. 118
8.4. CIP-51 Register Descriptions .......................................................................... 123
9. Memory Organization ............................................................................................ 126
9.1. Program Memory............................................................................................. 127
9.2. Data Memory ................................................................................................... 127
10. On-Chip XRAM ..................................................................................................... 129
10.1. Accessing XRAM........................................................................................... 129
10.2. Special Function Registers............................................................................ 130
11. Special Function Registers................................................................................. 131
11.1. SFR Paging ................................................................................................... 132
12. Interrupt Handler.................................................................................................. 137
12.1. Enabling Interrupt Sources ............................................................................ 137
12.2. MCU Interrupt Sources and Vectors.............................................................. 137
12.3. Interrupt Priorities .......................................................................................... 138
12.4. Interrupt Latency............................................................................................ 138
12.5. Interrupt Register Descriptions ...................................................................... 140
12.6. External Interrupts INT0 and INT1................................................................. 147
13. Flash Memory....................................................................................................... 149
13.1. Programming The Flash Memory .................................................................. 149
13.2. Non-volatile Data Storage ............................................................................. 151
13.3. Security Options ............................................................................................ 151
13.4. Determining the Device Part Number at Run Time ....................................... 153
13.5. Flash Write and Erase Guidelines ................................................................. 153
13.6. Minimizing Flash Read Current ..................................................................... 155
14. Power Management ............................................................................................. 159
14.1. Normal Mode ................................................................................................. 160
14.2. Idle Mode....................................................................................................... 161
14.3. Stop Mode ..................................................................................................... 161
14.4. Suspend Mode .............................................................................................. 162
14.5. Sleep Mode ................................................................................................... 162
14.6. Configuring Wakeup Sources........................................................................ 163
14.7. Determining the Event that Caused the Last Wakeup................................... 163
14.8. Power Management Specifications ............................................................... 165
15. Cyclic Redundancy Check Unit (CRC0)............................................................. 166
15.1. 16-bit CRC Algorithm..................................................................................... 166
15.2. 32-bit CRC Algorithm..................................................................................... 168
15.3. Preparing for a CRC Calculation ................................................................... 170
15.4. Performing a CRC Calculation ...................................................................... 170
15.5. Accessing the CRC0 Result .......................................................................... 170
15.6. CRC0 Bit Reverse Feature............................................................................ 174
16. On-Chip DC-DC Converter (DC0)........................................................................ 175
16.1. Startup Behavior............................................................................................ 176
16.2.
High Power Applications ............................................................................ 177
16.3. Pulse Skipping Mode..................................................................................... 177
16.4. Enabling the DC-DC Converter ..................................................................... 177
4
Rev. 1.2
Si1000/1/2/3/4/5
16.5. Minimizing Power Supply Noise .................................................................... 179
16.6. Selecting the Optimum Switch Size............................................................... 179
16.7. DC-DC Converter Clocking Options .............................................................. 179
16.8. DC-DC Converter Behavior in Sleep Mode ................................................... 180
16.9. DC-DC Converter Register Descriptions ....................................................... 181
16.10. DC-DC Converter Specifications ................................................................. 183
17. Voltage Regulator (VREG0)................................................................................. 184
17.1. Voltage Regulator Electrical Specifications ................................................... 184
18. Reset Sources ...................................................................................................... 185
18.1. Power-On (VBAT Supply Monitor) Reset ...................................................... 186
18.2. Power-Fail (VDD_MCU Supply Monitor) Reset............................................. 187
18.3. External Reset ............................................................................................... 189
18.4. Missing Clock Detector Reset ....................................................................... 189
18.5. Comparator0 Reset ....................................................................................... 190
18.6. PCA Watchdog Timer Reset ......................................................................... 190
18.7. Flash Error Reset .......................................................................................... 190
18.8. SmaRTClock (Real Time Clock) Reset ......................................................... 190
18.9. Software Reset .............................................................................................. 190
19. Clocking Sources................................................................................................. 192
19.1. Programmable Precision Internal Oscillator .................................................. 193
19.2. Low Power Internal Oscillator........................................................................ 193
19.3. External Oscillator Drive Circuit..................................................................... 193
19.4. Special Function Registers for Selecting and
Configuring the System Clock ....................................................................... 197
20. SmaRTClock (Real Time Clock).......................................................................... 200
20.1. SmaRTClock Interface .................................................................................. 200
20.2. SmaRTClock Clocking Sources .................................................................... 207
20.3. SmaRTClock Timer and Alarm Function ....................................................... 211
21. Port Input/Output ................................................................................................. 217
21.1. Port I/O Modes of Operation.......................................................................... 218
21.2. Assigning Port I/O Pins to Analog and Digital Functions............................... 219
21.3. Priority Crossbar Decoder ............................................................................. 221
21.4. Port Match ..................................................................................................... 226
21.5. Special Function Registers for Accessing and Configuring Port I/O ............. 229
22. EZRadioPRO
®
Serial Interface (SPI1) ................................................................ 238
22.1. Signal Descriptions........................................................................................ 239
22.2. SPI Master Operation on the MCU Core Side............................................... 239
22.3. SPI Slave Operation on the EZRadioPRO Peripheral Side........................... 239
22.4. EZRadioPRO Serial Interface Interrupt Sources ........................................... 242
22.5. Serial Clock Phase and Polarity .................................................................... 242
22.6. SPI Special Function Registers ..................................................................... 243
23. EZRadioPRO
®
240–960 MHz Transceiver.......................................................... 249
23.1. EZRadioPRO Operating Modes .................................................................... 250
23.2. Interrupts ...................................................................................................... 253
23.3. System Timing............................................................................................... 254
Rev. 1.2
5

SI1002-C-GMR Related Products

SI1002-C-GMR SI1005-C-GMR SI1001-C-GMR
Description Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, PQCC42 Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, PQCC42 Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, PQCC42
Is it Rohs certified? conform to conform to conform to
Maker Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc
package instruction HVQCCN, LCC42,.2X.27,25/20 HVQCCN, LCC42,.2X.27,25/20 HVQCCN, LCC42,.2X.27,25/20
Reach Compliance Code unknown unknown unknown
Has ADC YES YES YES
bit size 8 8 8
CPU series 8051 8051 8051
maximum clock frequency 30 MHz 30 MHz 30 MHz
DMA channel NO NO NO
JESD-30 code R-PQCC-N42 R-PQCC-N42 R-PQCC-N42
length 7 mm 7 mm 7 mm
Number of I/O lines 22 19 22
Number of terminals 42 42 42
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
PWM channel YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN HVQCCN HVQCCN
Encapsulate equivalent code LCC42,.2X.27,25/20 LCC42,.2X.27,25/20 LCC42,.2X.27,25/20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
power supply 1.8/3.6 V 1.8/3.6 V 1.8/3.6 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (bytes) 4352 4352 4352
rom(word) 65536 32768 32768
ROM programmability FLASH FLASH FLASH
speed 25 MHz 25 MHz 25 MHz
Maximum slew rate 5 mA 5 mA 5 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V
Nominal supply voltage 3 V 3 V 3 V
surface mount YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD
width 5 mm 5 mm 5 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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