Framer, CMOS, PQCC44, PLASTIC, LCC-44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC44,.7SQ |
| Contacts | 44 |
| Reach Compliance Code | compliant |
| Carrier type | CEPT PCM-30/E-1 |
| JESD-30 code | S-PQCC-J44 |
| JESD-609 code | e0 |
| length | 16.5862 mm |
| Number of functions | 1 |
| Number of terminals | 44 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum slew rate | 10 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | FRAMER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 16.5862 mm |





| LXP2181APE | LXP2181ANE | LXP2181AJE | |
|---|---|---|---|
| Description | Framer, CMOS, PQCC44, PLASTIC, LCC-44 | Framer, CMOS, PDIP40, PLASTIC, DIP-40 | Framer, CMOS, CDIP40, CERAMIC, DIP-40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Intel | Intel | Intel |
| Parts packaging code | LCC | DIP | DIP |
| package instruction | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Contacts | 44 | 40 | 40 |
| Reach Compliance Code | compliant | compliant | compliant |
| Carrier type | CEPT PCM-30/E-1 | CEPT PCM-30/E-1 | CEPT PCM-30/E-1 |
| JESD-30 code | S-PQCC-J44 | R-PDIP-T40 | R-GDIP-T40 |
| JESD-609 code | e0 | e0 | e0 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 44 | 40 | 40 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCJ | DIP | DIP |
| Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 5.842 mm | 5.842 mm |
| Maximum slew rate | 10 mA | 10 mA | 10 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Telecom integrated circuit types | FRAMER | FRAMER | FRAMER |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL |
| width | 16.5862 mm | 15.24 mm | 15.24 mm |