LXP2181AJE datasheet, PDF - EEWORLD Datasheet

LXP2181AJE: DescriptionFramer, CMOS, CDIP40, CERAMIC, DIP-40; CategoryWireless rf/communication Telecom circuit; File Size907KB，24 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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LXP2181AJE Overview

Framer, CMOS, CDIP40, CERAMIC, DIP-40

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	compliant
Carrier type	CEPT PCM-30/E-1
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
Number of functions	1
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.842 mm
Maximum slew rate	10 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

	LXP2181AJE	LXP2181APE	LXP2181ANE
Description	Framer, CMOS, CDIP40, CERAMIC, DIP-40	Framer, CMOS, PQCC44, PLASTIC, LCC-44	Framer, CMOS, PDIP40, PLASTIC, DIP-40
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Intel	Intel	Intel
Parts packaging code	DIP	LCC	DIP
package instruction	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6
Contacts	40	44	40
Reach Compliance Code	compliant	compliant	compliant
Carrier type	CEPT PCM-30/E-1	CEPT PCM-30/E-1	CEPT PCM-30/E-1
JESD-30 code	R-GDIP-T40	S-PQCC-J44	R-PDIP-T40
JESD-609 code	e0	e0	e0
Number of functions	1	1	1
Number of terminals	40	44	40
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP40,.6	LDCC44,.7SQ	DIP40,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.842 mm	4.57 mm	5.842 mm
Maximum slew rate	10 mA	10 mA	10 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	CMOS	CMOS	CMOS
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
width	15.24 mm	16.5862 mm	15.24 mm

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